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Precision
When accuracy really counts
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Micro Assembly
Sub-Micron assembly and packaging
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Advanced Rework
Beyond just rework
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Innovation
Technology for now and tomorrow
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Partnership
Globally responsive
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Quality
German Engineering
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Micro Assembly
Advanced performance equipment
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Advanced Rework
Proven equipment technology
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Human Factor
Experience that works for you
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Relaunch of Finetech Company Website
December 2009
New web portal combines easy access with a fresh design and enhanced...
2009 has been a very eventful year for Finetech. Working in many exciting projects together with our customers, bringing a new generation of FINEPLACER® system to life, seeing the Finetech family grow as well as giving Finetech a much deserved “facelift” has...
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Finetech to Acquire MARTIN GmbH, Munich
November 2009
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of...
Finetech CEO, Gunter Kuerbis explains that the Martin products complement perfectly the range of systems successfully sold around the world under the flagship FINEPLACER® name. Additionally, MARTIN CEO, Bernhard Martin sees that the addition of dispenser...
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FINEPLACER® matrix – "The new generation"
November 2009
With the FINEPLACER® matrix, Finetech is not only extending its product range,...
The modular thinking behind the FINEPLACER®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two...
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FINEPLACER® core - new upcoming entry-level rework system
November 2009
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its...
Providing an “out of the box” solution, FINEPLACER® core is based on Finetech’s proven hot air technology and has been designed to meet the requirements of professional rework applications – for today and tomorrow.
Compact design, full functionality
This compact...
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Rework of QFN - No Compromises
November 2009
Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame)...
Unlike BGA components, QFNs however do not provide a solder ball array for SMD assembly but have to be soldered to the assembly with their contact pads attached directly to the metalized body (lead frames). This technology makes much higher demands compared to the...
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IMAPS Device Packaging
March 9-10, 2010
Location: Ft. McDowell Resort, Scottsdale (AZ)
Booth: #46
On display: tba
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SEMICON China
March 16-18, 2010
Location: Shanghai New International Expo Centre (SNIEC), Shanghai, China
Booth: Hall W2
On display: FINEPLACER® lambda
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Nepcon Shanghai
April 20-22, 2010
Location:Shanghai Everbright Convention & Exhibition Center
Booth: coming soon
On display: FINEPLACER® core
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SMT Hybrid Packaging
June 08-10, 2010
Location: Messezentrum Nürnberg
Booth: #6-406
On display: complete product range
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SEMICON West 2010
July 13 – 15, 2010
Location: Moscone Center, San Francisco (CA)
Booth: #5570
On display: tba
Micro Assembly
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VCSEL and Photo Diodes
The assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
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Laser Bar Bonding
Solid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
Advanced Rework
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BGA Rework
BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but also to the broader SMT Rework market.
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Rework of Ultra Small Components (01005)
01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution
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Chip-on-Flex Rework
Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between different circuit layers.