-
-
-
Precision
When accuracy really counts
-
Micro Assembly
Sub-Micron assembly and packaging
-
Dispensing
Dispensing Systems for Automation
-
Advanced Rework
Beyond just rework
-
Innovation
Technology for now and tomorrow
-
Partnership
Globally responsive
-
Quality
German Engineering
-
Micro Assembly
Advanced performance equipment
-
Advanced Rework
Proven equipment technology
-
Human Factor
Experience that works for you
-
International User Meetings 2010
Register now for the "International User Meeting Micro Assembly" in Berlin and for the "International User Meeting Advanced Rework" in Budapest, Hungary.
-
Finetech Announces New Sales Partnership for UK and Ireland
Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.
-
FINEPLACER® core - Getting Started with Professional SMD Rework
During the SMT 2010 show Finetech is going to present its new SMD soldering and rework station FINEPLACER® core.
-
Chip-to-Wafer Assembly with
FINEPLACER® matrix ma
At the SMT 2010 show, Finetech is going to present Chip-to-Wafer applications with the next-generation bonding platform FINEPLACER® matrix ma.
-
Finetech Has Acquired MARTIN GmbH, Munich
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich, which was effective January 1, 2010.
-
GEM Expo 2010
October 5-7, 2010
Location: Green Hall, Centre Norte, Sao Paulo
Booth: #317
On display: FINEPLACER® core
-
ICEPT-HDP 2010
Aug 16-19, 2010
Location: Tang Cheng Hotel, Xi'an, China
Address: No.229, South Hanguang Road
-
GlobalTRONICS 2010
Sep 13-15, 2010
Location: Sands Expo and Convention Centre, Marina Bay Sands, Singapore
Booth: Hall A, booth #E18 (Dou Yee Enterprises)
On display: FINEPLACER® core
Micro Assembly
-
VCSEL and Photo Diodes with
FINEPLACER® Flip Chip BonderThe assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
-
Laser Bar Bonding with
FINEPLACER® Flip Chip BonderSolid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
Advanced Rework
-
Rework of Small Passives (01005) with
FINEPLACER® Rework Stations01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution
-
BGA Rework with
FINEPLACER® Rework StationsBGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but ...
-
Chip-on-Flex Rework with
FINEPLACER® Rework StationsFlexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and ...