Rework of BGA / CSP

BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but also to the broader SMT Rework market. Large sphere arrays (BGA), and small fine pitch arrays (CSP) demand configurations that combine precise thermal management and high resolution optics, to ensure a void-free rework process and accurate alignment.

De-soldered BGA component
BGA components on a large server board

What are the challenges?

One system for the complete rework cycle - from component removal to re-soldering?
Large arrays (20-65 mm) need large optical field of view, whereas smaller fine pitch CSP's (0,8-20 mm) need high magnification (both require good resolution)
Solder removal of irregular shaped residual
Need to remove the BGA, but leave the neighboring devices undisturbed?!
Want instant profiling?
Multilayer board sizes from USB stick (12x40 mm) to server board (500x465 mm)?

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The Finetech Solution

Remove, clean, paste, reball, replace

Desoldering Component
Soldering new Component
Residual Solder Removal
Applying new Solder Paste

Finetech provides a single platform that can perform the complete rework cycle:

Melt solder and remove the defective component with a specialized nozzle design
Residual solder removal using a contactless process - done in a single sweep, it produces safe, reproducible cleaning
Printing of solder paste on PCB, direct component printing or dispensing
Reball either a single defective ball or an entire array
Placement and reflow of new component ensuring accurate alignment

Process camera for in-situ process observation

View of process cam

It can be used for obervation of the reflow process or for taking pictures/videos for documentation purposes.

Split field optics and zoom magnification

Split Field Optic

The Split Field Optics Video Imaging System enables diametrically opposite corners of a large component, and its corresponding pad area on the substrate, to be viewed under high magnification.

Integrated Process Management (IPM)

Integrated Process Management (IPM)
Principle of process gas integration
Operating software for rework
Operating software for bonding

The Integrated Process Management (IPM) is the center piece of a FINEPLACER^® system¹ - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:

Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
Control of temperature, time, force, power, energy, flow
Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues

IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.

The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control. This is as easy as process development can get.