Rework of Ultra Small Components (01005)
01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution including component re-alignment or removal, site cleaning and optional paste application and replacement with the industries best optical resolution – incorporating real-time inspection during the process.
What are the challenges?
- Repair of components with any kind of defect: tomb-/book-stoned, cracked, missing, misplaced or rotated
- “All-in-one” solution for all process steps
- Difficulty seeing component with sufficient magnification and optical resolution
- Capable to allow in-situ process observation of the working area
- Secure component handling process from pick up from tape presentation to placement, controlling fragile components with very low mass (0.04g/1000 pcs.)
- Force-controlled handling and placement throughout the whole rework process
- Compensation of heat expansion by force balance
- Removing the target component without disturbing its neighbors
- Placing new components with at least 10 µm accuracy
- Solder paste dispensing or solder paste transfer with typical dots of about 200 µm dia.
- Tool design to allow access to densely assembled components with small clearance
The Finetech Solution
Adapted Tooling
- Highly precise tools with vacuum support for secure handling
- Designed to compensate thermal expansion effects
- Provides very localized top heat input to avoid disturbance of neighboured components
- Inert gas support provides process atmosphere adequate to reflow oven conditions
- Tool design allows access to densely assembled components with small clearance
Integrated Process Management (IPM)
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control. This is as easy as process development can get.
1 FINEPLACER® core offers co-ordinated top and bottom heating but does not support IPM
Recommended Equipment
- FINEPLACER® core
- FINEPLACER® pico rs
- FINEPLACER® micro rs
- FINEPLACER® jumbo rs
- FINEPLACER® micro hvr
- FINEPLACER® matrix rs
The recommended system depends on size and pitch of your component.



























































