Micro Assembly Day 2018

On May 17, 2018, Finetech will hold the Micro Assembly Day 2018. This one-day conference followed by a day of practical consultations is a platform for active knowledge-sharing and networking, aimed at experts and interested professionals from industry and science.

As a long-standing technology partner for assembly and packaging, Finetech offers profound expertise in various applications, along with their implementation in different industries and markets. The Micro Assembly Day 2018 covers a wide range of topics, from LiDAR and IR technology to flow sensors to 400G optical transceivers and pump laser sources. Related applications include, but are not limited to MEMS/MOEMS, VCSEL & photo diodes, chip-on-flex and chip-on-glass, high-power lasers and high pin count devices.

Registration via Eventbrite.

Eventbrite - Micro Assembly Day 2018


» Insights in technology trends and latest applications
» New contacts with potential partners
» Inspiration and ideas for your own projects
» Access to technological know-how
» Overview of new product developments
» Individual consultation on your application challenge on May 18, 2018


» Presentations on innovative developments
» Hands-on machine demos
» Exciting discussions in a pleasant atmosphere
» Guided tour around the Finetech development and production center
» Get-together dinner with a stunning view over the city center next to the Berlin Cathedral on May 16, 2018


Finetech Production & Development Center, Berlin-Marzahn

Please note: Due to the international background of the participants, the official language for presentations and discussions is English. 

Preliminary Agenda (as of Mar 07, 2018)

Wednesday - May 16, 2018 - Get-Together
17:00 Dinner at Restaurant Humboldt Terrassen, Berlin Mitte
Thursday - May 17, 2018 - Conference
08:30 Check-in
09:00 Welcome Note
» Gunter Kürbis (CEO - Finetech)
09:10 Challenges at FBH of Laser Diode Mounting for Applications from High Power to Spectroscopy
» Christoph Stölmacker (Ferdinand-Braun-Institut)
09:40Manual and Automating Manufacturing Processes in the Assembly of High Power Laser Diodes and Modules
» Simone Codato (Prima Electro)
10:10Finetech’s Path from Lab to Fab – Automatic Production Systems from a European Perspective
» Hermann Moos (Finetech)
10:40Coffee Break
11:00 tba.
11:30Next Generation 400G Transceiver Modules - Why the Half Micron is Key
» David Selicke (Sicoya)
12:00Company Tour
12:20 Lunch Break
13:15Next Generation Parallelism Control for μBump Interconnections in Demanding Applications
» Dr. Matthias Winkler (Finetech)
13:40A Round-up of New Hardware and Software Solutions for the Systems FINEPLACER® femto 2 and FINEPLACER® sigma
» Martin Rogge (Finetech)
14:05FINEPLACER® lambda 2 - A Sneak Peek Into the 2nd Generation of Finetech's Proven Lab Bonder
» Christoph Daedlow (Finetech)
14:30 Coffee Break
15:00Ultra-Thin Chips and Chip-Film Patch for Hybrid Systems in Foil - Technology and Applications
» Dr. Christine Harendt (Institut für Mikroelektronik Stuttgart)
15:25Inductive Bonding at Wafer and Chip Level for Microsystems Technology and Power Electronics
» Christian Hofmann (Fraunhofer Institute for Electronic Nano Systems)
Friday - May 18, 2016 - Individual Consultations (upon request)