Micro Assembly Day 2018

On May 17, 2018, Finetech will hold the Micro Assembly Day 2018. This one-day conference followed by a day of practical consultations is a platform for active knowledge-sharing and networking, aimed at experts and interested professionals from industry and science.

As a long-standing technology partner for assembly and packaging, Finetech offers profound expertise in various applications, along with their implementation in different industries and markets. The Micro Assembly Day 2018 covers a wide range of topics, from LiDAR and IR technology to flow sensors to 400G optical transceivers and pump laser sources. Related applications include, but are not limited to MEMS/MOEMS, VCSEL & photo diodes, chip-on-flex and chip-on-glass, high-power lasers and high pin count devices.

A detailed agenda with speakers and topics will follow shortly.

Registration starts on February 01, 2018.


» Insights in technology trends and latest applications
» New contacts with potential partners
» Inspiration and ideas for your own projects
» Access to technological know-how
» Overview of new product developments
» Individual consultation on your application challenge on May 18, 2018


» Presentations on innovative developments
» Hands-on machine demos
» Exciting discussions in a pleasant atmosphere
» Guided tour around the Finetech development and production center
» Get-together dinner with a keynote speaker and a stunning view over Berlin on May 16, 2018


Finetech Production & Development Center, Berlin-Marzahn

Please note: Due to the international background of the participants, the official language for presentations and discussions is English.