Micro Assembly
Advanced Rework

FINEPLACER^® pico ma Multi-purpose Bonder 5 micron accuracy
Application versatility
FINEPLACER^® matrix ma Semi-Automatic Bonder 3 micron accuracy
300 mm wafer bonder
FINEPLACER^® lambda Flexible Sub-Micron Bonder 0.5 micron accuracy
Application versatility
FINEPLACER^® pico ama Automated Flip Chip Bonder 5 micron accuracy
High flexibility
FINEPLACER^® femto Automated Sub-Micron Bonder 0.5 micron accuracy
Production platform

FINEPLACER^® core Industry leading, cost effective rework Proven technology where process reproducibility is critical
FINEPLACER^® core^plus Industry leading, cost effective rework Proven technology where process reproducibility is critical
FINEPLACER^® jumbo rs Large area rework station Board size to 750 x 500 mm
FINEPLACER^® matrix rs Future in advanced rework Smallest pitch, most complex integration, largest array device capable
FINEPLACER^® pico rs High density rework station Rework in high density environments
FINEPLACER^® micro rs Hot Air SMD Rework Station Large field of view
Board size to 460 x 310 mm
FINEPLACER^® micro hvr High volume rework station Board size to 350 x 260 mm

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