Press releases
International User Meetings 2010
July 2010
Register now for the "international user meeting micro assembly" in Berlin
Finetech Announces New Sales Partnership for UK and Ireland
July 2010
Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.
FINEPLACER® core - Getting Started with Professional SMD Rework
April 2010
During the SMT 2010 show Finetech is going to present its new SMD soldering and rework station FINEPLACER® core.
Chip-to-Wafer Assembly with
FINEPLACER® matrix ma
April 2010
At the SMT 2010 show, Finetech is going to present Chip-to-Wafer applications with the next-generation bonding platform FINEPLACER® matrix ma.
Finetech Has Acquired MARTIN GmbH, Munich
December 2009
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich, which was effective January 1, 2010.
Relaunch of Finetech Company Website
December 2009
New web portal combines easy access with a fresh design and enhanced functionality.
The New Generation Die Bonder & Rework Station - FINEPLACER® matrix
November 2009
With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family.
New industry leading, cost effective rework system - FINEPLACER® core
November 2009
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming cost effective rework system, the FINEPLACER® core.
Rework of QFN - No Compromises
November 2009
Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics are being increasingly incorporated into densely populated, space-saving assemblies.