Finetech

Get in Contact

Press releases

International User Meeting Micro Assembly

International User Meetings 2010

July 2010

Register now for the "international user meeting micro assembly" in Berlin

read more

Finetech Announces New Sales Partnership for UK and Ireland

July 2010

Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.

read more

Proven hot air technology

FINEPLACER® core - Getting Started with Professional SMD Rework

April 2010

During the SMT 2010 show Finetech is going to present its new SMD soldering and rework station FINEPLACER® core.

read more

C2W Assembly

Chip-to-Wafer Assembly with
FINEPLACER® matrix ma

April 2010

At the SMT 2010 show, Finetech is going to present Chip-to-Wafer applications with the next-generation bonding platform FINEPLACER® matrix ma.

read more

Finetech Has Acquired MARTIN GmbH, Munich

December 2009

We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich, which was effective January 1, 2010.

read more

Relaunch of Finetech Company Website

December 2009

New web portal combines easy access with a fresh design and enhanced functionality.

read more

Flip Chip Bonder

The New Generation Die Bonder & Rework Station - FINEPLACER® matrix

November 2009

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family.

read more

BGA rework station

New industry leading, cost effective rework system - FINEPLACER® core

November 2009

At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming cost effective rework system, the FINEPLACER® core.

read more

Rework of QFN - No Compromises

November 2009

Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics are being increasingly incorporated into densely populated, space-saving assemblies.

read more