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Coming Trade Shows

Finetech regularly informs customers and interested companies on developments and trends in bonding and rework technologies. Newsletters, events and exhibitions are used as information platforms.

Thank you for visiting our booths at this year's exhibitions.

Please find below upcoming trade shows.

Europe

SMT Hybrid Packaging

June 08-10, 2010

Location: Messezentrum Nürnberg

Booth: #6-406

On display: complete product range

America

APEX 2010

April 6 – 8, 2010

Location: Mandalay Bay Conference Center, Las Vegas (NV)

Booth: #2228

On display: FINEPLACER® core & FINEPLACER® pico rs

SEMICON West 2010

July 13 – 15, 2010

Location: Moscone Center, San Francisco (CA)

Booth: #5570

On display: tba

Asia / Pacific

Nepcon Shanghai

April 20-22, 2010

Location:Shanghai Everbright Convention & Exhibition Center

Booth: 2D10-D

On display: FINEPLACER® pico rs; FINEPLACER® lambda

Photonics Festival Taiwan

June 9-11, 2010

Location: TWCT, Taipei

Booth: tba.

On display: tba

Semicon Taiwan 2010

Sep 8-10, 2010

Location: TWCT, Taipei

Booth: Hall 1, booth #706

On display: tba

TPCA Show 2010

Oct 20 - 22, 2010

Location:TWCT, Taipei

Booth: tba

On display: tba

SEMICON China

March 16-18, 2010

Location: Shanghai New International Expo Centre (SNIEC), Shanghai, China

Booth: Hall W2

On display: FINEPLACER® lambda