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User Meeting "micro assembly"

September 29 will see Finetech hold the 8th International User Meeting "Micro Assembly" in Berlin. This events series aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.

As in previous year, the main focus will be on trends and challenges in the micro assembly sector. The Finetech team will be supported by high-profile experts from industry and research, adding presentations on current and future technological developments and case studies.

Open discussion sessions will give plenty of opportunities for dialog and exchange.

The meeting will be completed by a practical part where the participants will be introduced to innovative FINEPLACER® bonding solutions and have the chance to get a hands-on impression. All visitors are also invited to spend the evening together having dinner and enjoying one of the many cultural attractions Berlin has to offer.

For Friday, September 30,  interested visitors can make individual appointments with the Finetech experts to get advice on specific projects.

Organisation

Agenda (update 21.09.2011)

Demanding laser bonding/ testing applications, micro-optics assembly and soldering of complex opto-electronic devices are only some of the topics to be highlighted. International experts will contribute with presentations.

Conference language will be English.

09:00 amTechnologies & applications update; Soldering of opto-electronical devices
Dipl.-Ing. Martin Rogge (Finetech)
09:30 amBonding and testing of High Power LASER
Dipl.-Ing. Sascha Lohse (Finetech)
10:00 am Bonding of large dice and substrates
Dr. Matthias Winkler (Finetech)
10:30 am Coffee break
11:00 am Soldering by lasers and packaging by soldering - activities at Fraunhofer ILT
Dr. Jörn Miesner (Fraunhofer ILT)
11:30 amOptics placement
Dr. Klaus Ohlsen (Finetech)
12:00 amTechnological demands on bonding materials
Dipl.-Ing. Dominik Horn (Finetech)
12:30 pm Hermetic sealing technologies applied to MEMS and microsystems
Rony Jose James (CSEM Switzerland)
01:00 pmFinger Food Break
01:45 pmSub-micron bonding,
Dipl.-Ing. Lars Bretschneider (Finetech)
02:15 pm Assembly of multi-chip modules
Dipl.-Ing. Christoph Daedlow (Finetech)
02:45 pmGuided tour: new clean room laboratory;
Hands-on & discussions
05:00 pmEvening program

Conference location is Wolfener Straße 36, Haus der Wirtschaftspartner, 12681 Berlin.

Accommodation

We recommend timely booking with the Abacus Tierpark Hotel. Finetech holds a limited allotment of single rooms (82,50 € incl. breakfast) until August 28, 2011.

If you would like to use this offer,  please make your reservation directly with the hotel using the keyword "Finetech".

Finetech will arrange a shuttle service from the ABACUS hotel to the Finetech headquarters on Thursday, September 29 at 8.15 am. Please state in the registration form if you would like to use the shuttle service.

Registration

All correspondence between you and Finetech regarding your participation will preferably be conducted via e-mail. Check the e-mail address by which you register with us on a regular basis to keep track of the latest location and agenda details.

Participation in the "User Meeting Micro Assembly" is free, all travel costs and accommodation are at your own expense.

Please find below the registration link for your participation.

Downloads

agenda_berlin_2010.pdf Agenda "user meeting micro assembly" 2010 Berlin 605 KB