For customers and specialists working in the field of advanced packaging, Finetech will offer the International User Meeting Micro Assembly to be held in Berlin on September 30, 2010.

In 2010, Finetech will provide for the first time separate User Meetings for micro assembly and rework customers to ensure full commitment to the respective segments during the event.

During the International User Meeting Micro Assembly, you will get in touch with customers, prospects, industry representatives and representatives from universities and scientific institutions for a prolific exchange of experiences.

Confirmed presentations include

Assembly Challenges For Next Generation Photonic Hybrid Integration Modules
Dr. Graeme Maxwell (CIP Technologies)

Packaging of High Power Diode Laser Bar
Dipl.-Ing. Michael Leers (ILT Aachen)

Assembly of Lens Holder
Dipl.-Ing. Tino Alban (Silicon Micro Sensor)

Sensor Assembly Technologies
Roman Schmidt (Project Manager Technology, Elbau GmbH)

with additional presentations on

- Soldering of High Power Components
- Lens Placement
- Active Alignment
- Through‐hole silicon via (TSV)
- Finetech Micro Assembly Product Range – Technologies & Applications
- and more

The International User Meeting Micro Assembly will have a strong workshop character with plenty of opportunities to discuss your specific questions with our Finetech product and application engineers.

The event agenda also includes lectures and presentations on the latest Finetech equipment and application solutions as well as a joint evening program.

A preliminary event agenda can be downloaded at the bottom of this page.

More updates on the Finetech International User Meeting Micro Assembly,  location info as well as a final agenda will be available on time, please check back regularly for updates.