FINEPLACER^® pico ma Multi-purpose Bonder 5 micron accuracy
Application versatility
FINEPLACER^® matrix ma Semi-Automatic Bonder 3 micron accuracy
300 mm wafer bonder
FINEPLACER^® lambda Flexible Sub-Micron Bonder 0.5 micron accuracy
Application versatility
FINEPLACER^® pico ama Automated Flip Chip Bonder 5 micron accuracy
High flexibility
FINEPLACER^® femto Automated Sub-Micron Bonder 0.5 micron accuracy
Production platform

FINEPLACER^® core Industry leading, cost effective rework Proven technology where process reproducibility is critical
FINEPLACER^® core^plus Industry leading, cost effective rework Proven technology where process reproducibility is critical
FINEPLACER^® jumbo rs Large area rework station Board size to 750 x 500 mm
FINEPLACER^® matrix rs Future in advanced rework Smallest pitch, most complex integration, largest array device capable
FINEPLACER^® pico rs High density rework station Rework in high density environments
FINEPLACER^® micro rs Hot Air SMD Rework Station Large field of view
Board size to 460 x 310 mm
FINEPLACER^® micro hvr High volume rework station Board size to 350 x 260 mm

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Profiling Service

Save time and money with approved rework solder profiles! Finetech provides the opportunity to order custom-made profiles for your specific rework challenges.

Let us do the job to determine the best possible solder profiles for your rework process.

What are the benefits of custom-made profiles?

There are a number of obvious advantages when entrusting Finetech with the development of your rework solder profiles:

economy of time and money
professional consulting: Finetech has more than 15 years of profound experience in advanced rework
creation of a profile in accordance with the customers or the IPC’s specifications
process security: Finetech guarantees the created profiles are working reliably and will meet your demands perfectly
professional documentation
a compendium of related materials (e.g. profiles, protocols, pictures) will be additionally provided on CD

In our modern application department we have access to the whole spectrum of FINEPLACER^® machines and corresponding jets and nozzles. The profile creation will be conducted by a specialized application team with long-time experience in the field of profile engineering.

What do we need?

To ensure a quick and secure profile creation, given technical circumstances must be clarified in advance. Typical specifications we need to know are

specifications of component and board
demands regarding time behaviour, temperature behaviour and other environment variables
used/required materials: solder paste, flux etc.

To assess feasibility, we will normally send you a questionnaire and ask you to send us a sample of your boards together with the corresponding description of applications. Once the assembly arrives, we will conduct various trials to confirm feasibility and to obtain further information necessary to offer a customer-specific quotation.

Finetech