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International User Meetings 2010
Register now for the "international user meeting micro assembly" in Berlin
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Finetech Announces New Sales Partnership for UK and Ireland
Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.
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FINEPLACER® core - Getting Started with Professional SMD Rework
During the SMT 2010 show Finetech is going to present its new SMD soldering and rework station FINEPLACER® core.
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Chip-to-Wafer Assembly with
FINEPLACER® matrix ma
At the SMT 2010 show, Finetech is going to present Chip-to-Wafer applications with the next-generation bonding platform FINEPLACER® matrix ma.
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Finetech Has Acquired MARTIN GmbH, Munich
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich, which was effective January 1, 2010.
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GEM Expo 2010
October 5-7, 2010
Location: Green Hall, Centre Norte, Sao Paulo
Booth: #317
On display: FINEPLACER® core
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SMTA International
Oct 26-27, 2010
Location: Walt Disney World Swan & Dolphin, Orlando, FL
Booth: #406
On display: FINEPLACER® coreplus
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SEMICON Taiwan 2010
Sep 8-10, 2010
Location: TWCT, Taipei
Booth: Hall 1, booth #706
On display: FINEPLACER® femto
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GlobalTRONICS 2010
Sep 13-15, 2010
Location: Sands Expo and Convention Centre, Marina Bay Sands, Singapore
Booth: Hall A, booth #E18 (Dou Yee Enterprises)
On display: click on 'Read more'
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SMTA Chapter Penang Vendor Show
Nov 19, 2010
Location: Eastin Hotel Penang, Malaysia
Address: 1, Solok Bayan Indah, Queensbay, 11900 Bayan Lepas
Micro Assembly
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VCSEL and Photo Diodes with
FINEPLACER® Flip Chip BonderThe assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
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Laser Bar Bonding with
FINEPLACER® Flip Chip BonderSolid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
Advanced Rework
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Chip-on-Flex Rework with
FINEPLACER® Rework StationsFlexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and ...
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Rework of Small Passives (01005) with
FINEPLACER® Rework Stations01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution
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BGA Rework with
FINEPLACER® Rework StationsBGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but ...