Finetech

Get in Contact
  • Micro Assembly, Flip Chip Bonder, Die Bonder
  • APEX 2010

    April 6 – 8, 2010

    Location: Mandalay Bay Conference Center, Las Vegas (NV)

    Booth: #2228

    On display: FINEPLACER® core & FINEPLACER® pico rs

    read more

  • SEMICON West 2010

    July 13 – 15, 2010

    Location: Moscone Center, San Francisco (CA)

    Booth: #5570

    On display: tba

    read more

  • SEMICON China

    March 16-18, 2010

    Location: Shanghai New International Expo Centre (SNIEC), Shanghai, China

    Booth: Hall W2

    On display: FINEPLACER® lambda

    read more

  • TPCA Show 2010

    Oct 20 - 22, 2010

    Location:TWCT, Taipei

    Booth: tba

    On display: tba

    read more

  • Semicon Taiwan 2010

    Sep 8-10, 2010

    Location: TWCT, Taipei

    Booth: Hall 1, booth #706

    On display: tba

    read more

  • Photonics Festival Taiwan

    June 9-11, 2010

    Location: TWCT, Taipei

    Booth: tba.

    On display: tba

    read more

  • Nepcon Shanghai

    April 20-22, 2010

    Location:Shanghai Everbright Convention & Exhibition Center

    Booth: 2D10-D

    On display: FINEPLACER® pico rs; FINEPLACER® lambda

    read more

  • SMT Hybrid Packaging

    June 08-10, 2010

    Location: Messezentrum Nürnberg

    Booth: #6-406

    On display: complete product range

    read more

Micro Assembly

Advanced Rework