-
Precision
When accuracy really counts
-
Micro Assembly
Sub-Micron assembly and packaging
-
Dispensing
Dispensing Systems for Automation
-
Advanced Rework
Beyond just rework
-
Innovation
Technology for now and tomorrow
-
Partnership
Globally responsive
-
Quality
German Engineering
-
Micro Assembly
Advanced performance equipment
-
Advanced Rework
Proven equipment technology
-
Human Factor
Experience that works for you
-
Finetech Has Acquired MARTIN GmbH, Munich
We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich, which was effective January 1, 2010.
-
Relaunch of Finetech Company Website
New web portal combines easy access with a fresh design and enhanced functionality.
-
The New Generation Die Bonder & Rework Station - FINEPLACER® matrix
With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family.
-
New industry leading, cost effective rework system - FINEPLACER® core
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming cost effective rework system, the FINEPLACER® core.
-
Rework of QFN - No Compromises
Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics are being increasingly incorporated into densely populated, space-saving assemblies.
-
SEMICON West 2010
July 13 – 15, 2010
Location: Moscone Center, San Francisco (CA)
Booth: #5570
On display: tba
-
SEMICON China
March 16-18, 2010
Location: Shanghai New International Expo Centre (SNIEC), Shanghai, China
Booth: Hall W2
On display: FINEPLACER® lambda
-
Nepcon Shanghai
April 20-22, 2010
Location:Shanghai Everbright Convention & Exhibition Center
Booth: 2D10-D
On display: FINEPLACER® pico rs; FINEPLACER® lambda
-
SMT Hybrid Packaging
June 08-10, 2010
Location: Messezentrum Nürnberg
Booth: #6-406
On display: complete product range
Micro Assembly
-
Laser Bar Bonding with
FINEPLACER® Flip Chip BonderSolid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
-
VCSEL and Photo Diodes with
FINEPLACER® Flip Chip BonderThe assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
Advanced Rework
-
Chip-on-Flex Rework with
FINEPLACER® Rework StationsFlexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and ...
-
BGA Rework with
FINEPLACER® Rework StationsBGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but ...
-
Rework of Small Passives (01005) with
FINEPLACER® Rework Stations01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution