Thank You for Joining Us at Laser World of Photonics 2025

Discover our highlights, explore innovations, and rewatch the moments that matter.

We were thrilled to connect with you in Munich at one of the world’s leading photonics event. If you missed anything, or want a second look, we’ve gathered everything here: from the launch of our fastest die bonder ever to deep insights on scalable photonic manufacturing.

Featured Videos

Product Launch: FINEPLACER^® femto pro

Meet the fastest FINEPLACER^® ever designed for production.
Engineered for speed, precision, and long-term adaptability — the femto pro is made for advanced packaging needs, including:

Silicon Photonics
Photonic Integrated Circuits
Co-Packaged Optics
Quantum Photonics

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TechTalk: Dynamic Manufacturing of Integrated Photonics

Presented by: Martin Rogge, Head of Product Management.

Held on: June 25, 2025 | 12:40–13:00
Location: Integrated Photonics Applications Forum (Room A2.250)

This session offered expert insights into modular manufacturing strategies and how they shape the future of integrated photonics. If you missed it — or want to revisit the key takeaways — the full presentation is now available.

Tradeshow Impressions

Explore our post-tradeshow gallery and relive the excitement of Laser World of Photonics 2025. A key highlight was the launch of our new FINEPLACER^® femto pro — a next-generation solution in die bonding technology. Discover moments from the unveiling, live demos of our automated and prototyping systems, and insightful meetings that deepened customer connections.

Product Highlights

At Laser World of Photonics 2025, we showcased a selection of our key technologies in die bonding. On display were our high-precision automated die bonders, flexible prototyping platforms, and the newly launched Femto Pro. Each system demonstrated our focus on innovation, precision, and adaptability. Live demonstrations attracted significant attention, offering visitors hands-on insights into the performance and capabilities of our solutions.

Be among the first to experience the fastest FINEPLACER^® ever designed for production.

The FINEPLACER^® femto pro is an automated die bonder that blends unmatched speed with the precision and accuracy synonymous with the FINEPLACER^® femto line.

Future-proof solution for advanced packaging
Tailored for your process needs
Industry leading bonding quality

Master precision bonding in research and development with process flexibility and sub-micron accuracy

Ideal for labs and prototyping environments, the FINEPLACER^® lambda 2 empowers users with precise, hands-on control across a wide range of micro assembly applications.

Designed for process development and hands-on innovation
Tailored for unmatched placement accuracy in a compact footprint
Modular platform ensuring versatility in R&D

Didn’t Get a Chance to Visit?
No Worries!

There is always a way to connect. Let us walk you through the solutions we shared and how they can move your project forward.
Reach out to your regional contact and make an appointment today.