Laser Bar Bonding
In comparison to single lasers, laser bars consist of several single edge-emitting lasers comprised in a silicon bar. Bundling the light results in significantly increased output power as needed in a wide range of applications.
Laser bars are high power products, applied wherever small and efficient light-emitting units are needed. They mainly serve as pumping sources for optical resonators of high power lasers. Another field of use can be found in medical appliances.
What are the challenges?
- Sensitive components with brittle materials and optically active areas
- Delicate edges and facettes
- Perfect coplanarity required to ensure proper thermal management
- Highest placement accuracy needed to ensure defined overhang
- Stacked mounting (lasers to submount) requires different solder materials with their appropriate profiles
- Void free bonding
- Solder materials are prone to oxidation, process integration required
- High magnification of large components
- Indium bonding under process gas atmosphere
The Finetech Solution
Tools & Modules
- Automatic Bonding Force Modules provide control of force
- Active and passive equalization tools guarantee even bond line
- Unique fixed beam splitter, in combination with rotating placement arm, minimize placement error
- 2-point-alignment of long narrow components by scanning with movalble optics slide
- Full-automatic process with substrate and component handling
- Pattern recognition to find edges to coincide
Process Gas Integration
- Sophisticated support of AuSn and In joints under defined atmosphere
- Process gas for shielding and oxide layer reduction
- Self-sufficient formic acid gas generation
- Safe handling of fluid formic acid
- Numerous standard and custom process gas enclosures with controlled injection and outlet
- Automatic control of activation time and concentration for reproducible results
Integrated Process Management (IPM)
Integrated Process Management (IPM)
Principle of process gas integration
Operating software for rework
Operating software for bonding
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control. This is as easy as process development can get.
