Thermocompression Bonding
Thermocompression bonding is a connection process that does not need bonding wires. It is mainly used in case of Flip Chip bonding and generates a mechanically and electrically stable connection by material engagement. All contacts are bonded at the same time.
What are the challenges?
- Apply force and heat to the component simultaneously
- Minimize substrate heater's compliance to absorb bonding force without deformation
- Prevent thermal drift of heated area over a large temperature range (requires sophisticated support elements in connection with thermally compensated materials)
- Provide thermally and mechanically stable component heater
- Provide stable, fine resolution bonding force control to bond even the thinnest and most brittle materials as well as large components with lots of bumps
- Achieve micron range coplanarity between component and substrate (requires adapted tooling or sensors and activators to detect and compensate deviations)
The Finetech Solution
Principle of Thermocompression Bonding
After accurate alignment and placement of the chip to the substrate the chip and substrate are heated up to the melting temperature of the interconnect material. If gold is used the melting temperature will be about 320°C. Simultaneously force is applied to the chip and controlled during the whole bonding process.
Integrated Process Management (IPM)
Integrated Process Management (IPM)
Principle of process gas integration
Operating software for rework
Operating software for bonding
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control. This is as easy as process development can get.