VCSEL & Photo Diodes
optoelectronic transceiver packaging
The assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and combined devices are the cornerstones for new photonic applications allowing highest data rates. Besides a gentle handling of small components and fragile materials, the high accuracy alignment has to be combined with an appropriate bonding technology. Finetech's automated FINEPLACER® systems offer a complete solution with highly reproducible precision and wide range technology support.
What are the challenges?
- Bonding optically active structures face up or flipped
- From single emitters up to 12x arrays
- Position referencing chip to substrate or chip to chip
- PR on active structures to achieve highest accuracy
- Apply adhesives with small and stable volumes
- Embedded thermal and UV curing
- Bonding of dipped component glue dipping Align and bond optical lenses
The Finetech Solution
Bonding of VCSEL+ VCSEL Arrays / Photodiodes + Photodiode Arrays / Lens Arrays
Finetech provides a single platform that can perform the complete assembly:
- Pick up components from different presentations (e.G. GelPak®)
- Dip components into glue or dispense glue on programmed positions
- Automated alignment and bonding of various components
- Easy to adept library system for fast process development
- Integrated measurement functions to observe bonding results
Up to 0.5 µm Bonding Accuracy + Passive Optical Alignment
The optical coupling needed in such an application can be simplified or even avoided by using high accurate passive placement.
Bonded emitter arrays can be perfectly aligned to photodiode arrays to directly match defined parallel links. Lens arrays can additionally be mounted to complete a fiber optic interface.
Extended Field of View + High Magnification
Small structures to be recognized do require high optical magnifications. For all that, small and restricted fields of view would restrain flexibility of a PR system.
With fast and high precision optics movement and working stage, the FINEPLACER® femto enlarges its field of view without compromising accuracy.
Thus, large components and substrates can be captured and observed with the same quality as tiny ones. Especially for VCSEL and PD arrays with dimensions of 200 x 3000 µm and active structures below 5 µm this benefit can be important.
Integrated Process Management (IPM)
Integrated Process Management (IPM)
Principle of process gas integration
Operating software for rework
Operating software for bonding
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control. This is as easy as process development can get.
