Your partner for precision die bonding and process development
Visit us at Hall B2, Booth 405.
Exclusive Preview – get a first look at the future of die bonding
Be part of Finetech’s innovation journey. Our new production platform is still in development – but we’re ready to share an exclusive first preview. Discover how next-generation automation, wafer handling, and bonding technologies are coming together – and help us shape what’s next.
Your partner for precision die bonding and process development
Driven by over 30 years of engineering excellence, we present our latest die bonding solutions for advanced packaging, photonics, and semiconductor applications – from high-precision manual systems to fully automated production platforms.
Experience how Finetech’s innovative technologies enable precise, reliable, and flexible micro assembly across the entire die packaging value chain.
Visit us at Hall B2, Booth 405.
Exclusive Preview – get a first look at the future of die bonding
Be part of Finetech’s innovation journey. Our new production platform is still in development – but we’re ready to share an exclusive first preview. Discover how next-generation automation, wafer handling, and bonding technologies are coming together – and help us shape what’s next.
Product Highlights & Live Demos
FINEPLACER® femto family
Automated die bonders for advanced packaging needs.
Seamless transition from prototype to high-yield production. All the precision you need. Long-term process stability. Covered die attach technologies include:
- Cold/Thermocompression Bonding (e.g. Indium Bump)
- Adhesive/Epoxy Bonding/UV Curing
- Eutectic Bonding
FINEPLACER® lambda 2
Precision bonding in research and development with process flexibility and sub-micron accuracy
Ideal for labs and prototyping environments, precise, hands-on control across a wide range of die attach technologies:
- 2.5D and 3D IC Packaging (Stacking)
- Thermo- / Ultrasonic Bonding
- Adhesive Bonding
Live Talk – advanced die packaging for quantum technologies
Wednesday, 19 November 2025 | Productronica Forum A1.105
Join Finetech’s experts for an in-depth look at advanced die bonding approaches enabling the next generation of quantum technologies – from superconducting processors to photonic integration and quantum key distribution systems
