FINEPLACER® femto
Automated Sub-Micron Bonder
The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.
This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.
FINEPLACER® femto has the best cost - performance ratio of its class in the market.
Highlights
- Placement accuracy better than 0.5 µm
- Component sizes from 0,07² mm² to 100² mm²*
- Working area up to 450 mm x 150 mm*
- Supports wafer/substrate sizes* up to 12"
- Supports bonding forces up to 500 N*
- Wide range precision positioning stage
- Universal fixture for simplified and economical tool handling
- Small footprint and compact design
Features
- Automated pattern recognition, alignment and bonding
- Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
- Virtually unlimited range of advanced bonding technologies
Benefits
- Full automatic, user independent process
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Fast and easy process development
- Immediate visual feedback reduces process development time
- ROI savings - one machine for all applications
Technologies
- Thermocompression
- Thermosonic
- Ultrasonic
- Soldering (AuSn, C4, Indium, eutectic)
- Adhesive technologies
- Curing (UV, thermal)
- Mechanical assembly
Applications
- Laser diode, laser bar bonding
- VCSEL, photo diode assembly
- LED bonding
- Micro optics assembly
- MEMS/MOEMS packaging
- Sensor packaging
- 3D packaging
- Wafer level packaging (W2W, C2W)
- Chip on glass, Chip on flex
- Flip chip (face down)
- Precise die bonding (face up)