FINEPLACER® lambda
Flexible Sub-Micron Bonder
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.
The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.
This cost-effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP. Automated process modules are available.
Highlights
- Placement accuracy better than 0.5 µm
- Component sizes from 0.07² mm² to 60 x 90 mm²*
- Working area up to 300 mm x 73 mm*
- Supports wafer sizes* up to 6"
- Supports bonding forces up to 400 N*
- Closed loop force control*
- Small footprint and compact design
- Optics movement with programmable positions
Features
- Automated processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
- Virtually unlimited range of advanced bonding technologies
Benefits
- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Process transfer from R&D to production saves time, guarantees reliable results
- ROI savings - one machine for all applications
Technologies
- Thermocompression
- Thermosonic
- Ultrasonic
- Soldering (AuSn, C4, Indium, eutectic)
- Adhesive technologies
- Curing (UV, thermal)
- Mechanical assembly
Applications
- Laser diode, laser bar bonding
- VCSEL, photo diode assembly
- LED bonding
- Micro optics assembly
- MEMS/MOEMS packaging
- Sensor packaging
- 3D packaging
- Wafer level packaging (W2W, C2W)
- Chip on glass, chip on flex
- Flip chip (face down)
- Precise die bonding (face up)