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FINEPLACER® matrix ma

Semi-Automatic Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best” philosophy, this system points the way forward for the Finetech product family.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

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    FINEPLACER® matrix ma
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Highlights

  • Placement accuracy better than 3 µm
  • Component sizes from 0,1² mm² to 150² mm² *
  • Substrate sizes up to 350² mm² *
  • Supports wafer sizes up to 300 mm*
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Low maintenance, easy service access as a design priority
  • Fast conversion from die bonder to rework station*

* depending on configuration

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies 

Benefits

  • Hands-off die placement, user independent process
    operation
  • Outstanding placement accuracy and instant
    operation without adjustments
  • Synchronized control of all process related
    parameters: force, temperature, time, power, process
    environment and illumination
  • Immediate visual feedback reduces process
    development time
  • Process transfer from R&D to production saves time,
    guarantees reliable results
  • ROI savings - one machine for all applications

Technologies

  • Thermocompression
  • Thermosonic
  • Ultrasonic
  • Soldering (AuSn, C4, Indium, eutectic)
  • Adhesive technologies
  • Curing (UV, thermal)
  • Mechanical assembly

Applications

  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS/MOEMS packaging
  • Sensor packaging
  • 3D packaging
  • W2W, C2W
  • Chip on glass, chip on flex
  • Flip chip (face down)
  • Precise die bonding (face up)