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FINEPLACER® matrix ma

Semi-Automatic Bonder

The FINEPLACER® matrix ma is a newly developed, semi-automatic bonder that points the way forward for the Finetech product family.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

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Highlights

  • Placement accuracy better than 3 µm
  • Component sizes from 0.125 mm to 100 mm
  • Substrate sizes up to 350 mm x 350 mm
  • Supports wafer sizes up to 300mm
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Low maintenance, easy service access as a design priority
  • Fast conversion from die bonder to rework station

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies 

Benefits

  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Process transfer from R&D to production saves time, guarantees reliable results
  • ROI savings - one machine for all applications

Technologies

Applications