FINEPLACER® pico ama
Automated Flip Chip Bonder
FINEPLACER® pico ama a cost effective, fully-automated bonder, offering a high level of application flexibility. This award winning system is targeted for low volume production environments, as well as product and process development where flexibility is crucial.
Highlights
- Placement accuracy 5µm @ 3 sigma
- Component sizes from 0,15² mm² to 40 x 50 mm²*
- Working area up to 450 mm x 117 mm*
- Supports wafer/substrate sizes* up to 8"
- Supports bonding forces up to 50 N*
- Closed loop force control
- Fully automatic operation and assembly process
- Precise non-wearing xy planar table
- Traceability support with open data interface structure
- Flexible, cost effective performance
Features
- Automated pattern recognition, alignment and bonding
- Overlay vision alignment system with fixed beam splitter
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
- Virtually unlimited range of advanced bonding technologies
Benefits
- Full automatic, user independent process
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Fast and easy process development
- Immediate visual feedback reduces process development time
- ROI savings - one machine for all applications
Technologies
- Thermocompression
- Thermosonic
- Ultrasonic
- Soldering (AuSn, C4, Indium, eutectic)
- Adhesive technologies
- Curing (UV, thermal)
- Mechanical assembly
Applications
- Laser diode, laser bar bonding
- VCSEL, photo diode assembly
- LED bonding
- Micro optics assembly
- MEMS/MOEMS packaging
- Sensor packaging
- 3D packaging
- Chip on glass, Chip on flex
- Flip chip (face down)
- Precise die bonding (face up)