Finetech

Schließen
Schließen

User login

Enter your username and password here in order to log in on the website:


Forgot your password?

Register a new account!

Registration

Get in Contact

FINEPLACER® pico ma

Multi-purpose Bonder

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.

  • Flash is required!
  • Pico MA for TC
    FINEPLACER® matrix ma - Pico MA for TC
  • Videos
  • Pictures

Highlights

  • Placement accuracy better than 5 µm
  • Component sizes from 0,125² mm² to 100² mm²*
  • Working area up to 450 mm x 122 mm*
  • Supports wafer/substrate sizes* up to 8"
  • Supports bonding forces up to 400 N*
  • Can be configured as a hot air rework system
  • Manual and semi-automatic configurations

* depending on configuration

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Advanced system software with adaptive process library
  • Process transfer from system to system
  • Process flexibility due to modular concept

Benefits

  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments 
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development, process recording and reporting, photo capture
  • Process transfer from R&D to production saves time, guarantees reliable results
  • One system handles a wide variety of applications

Technologies

Applications