FINEPLACER® pico rs
High density rework station
The FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.
Application area from 01005 up to 40x40 BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
Highlights
- Industry-leading thermal management
- Placement accuracy better than 5 µm
- Component sizes from 0.125² mm² to 90 x 70 mm² *
- Board sizes up to 400 mm x 234 mm *
- High efficiency board heater
- Closed loop force control*
- Automated top heater calibration*
* depending on configuration
Features
- Automated soldering processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Modular design
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
Benefits
- Hands-off component placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of application flexibility
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Identical results on different machines allow central profile development, administration and distribution
Technologies
- Component removal
- Site cleaning
- Re-balling (single, array)
- Solder paste printing (component, PCB)
- Dispensing
- Dipping
- Soldering
- Desoldering
Applications
- Soldering of:
- BGA, µBGA/CSP, QFN, PoP, QFP, PGA,
- Small passives down to 01005
- RF shields, RF frames, connectors, sockets
- Sub assemblies, daughter boards
- Flipchip (C4)
- Pin in paste (PiP)
- THT rework
- Reworkable underfill, conformal coating
- Single ball rework


































