Rework of Shielded SMDAs PCB real-estate continues to be in high demand, the RF shield design will remain a challenge to rework.
Rework of BGA / CSPBGA Rework has become synonymous for SMT Rework in general. Learn more...
Rework of QFN / MLFFlat packages such as QFN provide many benefits but make much higher demands compared to the handling of standard SMD components.
Small Passives01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.).
Package on Package (PoP)Package on Package (PoP) is an IC-packaging technology with vertical combined logic and memory components where two or more BGAs (Ball Grid Arrays) are stacked.
Flip Chip ReworkFlip Chip rework is becoming more important in order to save costs by recycling valuable materials.
Chip-on-Flex ReworkFlexible substrates are used in 3D connection and mechatronic concepts for...
Underfill ReworkUnderfilled chips are used in consumer electronics, automotive industry or many miniaturized product.
Single Ball ReballingFinetech offers reliable reballing solutions for single ball replacement down to 200 µm dia.
Array ReballingThe accurate placement a new array of solder spheres is called array reballing.
Residual Solder RemovalThis section deals with the process related issue of eliminating residual solder once a component has been removed from a PCB.
Apply Solder PasteFinetech offers various equipment solutions to integrate the suitable solder application method into the rework cycle.
Laser Bar BondingSolid state lasers are versatile light-emitting optical units which...
VCSEL & Photo DiodesThe assembly and packaging of optoelectronic devices is...
RFID AssemblyRFID (Radio Frequency Identification) tags are used as an alternative to...
Adhesive TechnologiesAdhesive materials can be applied between two join partners in various ways.
ThermocompressionTC bonding is a connection process that does not need bonding wires. It is mainly used in case of Flip Chip bonding.