The Finetech Blog

This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.

// LED Bonding

Light Emitting Diodes (LEDs) are by definition a two-lead semiconductor light source, which release energy in the form of photons that have the color of light. What color? Well, likely

// Micro Assembly Day 2018 a Success

On May 17, 2018, around 50 European professionals from industry and science followed our invitation to join the Micro Assembly Day 2018. This annual one-day conference in Berlin is a

// Is Rework a Commodity?

Finetech has been a leader in SMT Rework and Repair equipment since the company was founded more than 25 years ago. You know what’s crazy? The very first machine we

// LiDAR Everywhere!

Is it me or is everyone in technology talking about LiDAR these days? So what is it and why is everyone talking about it?

// Laser Assist and Laser Bonding

Achieving a void-free eutectic Gold/Tin (e.g. Au80Sn20) bond for laser bar bonding is a pretty straight forward process. Conventional bonders use some method of conduction to heat both the substrate

// Bonding Materials and Methods

It’s always interesting to learn about the chemistries our customers will use in next generation bonding technologies. There is so much to take into account.

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