Innovative Solutions for Precision Die Bonder FINEPLACER® lambda

With the acclaimed sub-micron die bonder FINEPLACER® lambda, German equipment manufacturer Finetech offers one of the most compelling high-precision die packaging systems for flexible process and product development. A number of innovative solutions continue to make it a first choice when working with very small semiconductor and optical components.

Over the course of almost 25 years, Berlin based equipment manufacturer Finetech has evolved into one of the globally leading system providers for advanced die packaging and micro assembly. Their FINEPLACER® product family includes manual to fully automated die bonder systems for R&D and production.

Number one choice for process development with high placement requirements is the sub-micron die bonder FINEPLACER® lambda. The machine was designed with particular attention to the requirements of a laboratory environment. This includes a high degree of configurability for flexible integration of packaging technologies as well as fast process setup times and instant operation. The developed processes are fully compatible and can be applied later to automated Finetech production equipment.

In its latest iteration, the FINEPLACER® lambda comes with a number of innovations particularly addressing the challenges of working with ultra-small components.

Solutions to see smallest components

One of the core capabilities the FINEPLACER® lambda’s excellent reputation is built on is the superior optical resolution. A combination of USB HD cameras and high quality zoom optics make for a very capable Vision Alignment System. For even more flexibility, various zoom optics can be easily interchanged in order to configure the available field of view. The smallest field of view achieves 0.7 µm resolution, giving users a more detailed picture when working with ultra-small components.

In order to overcome the constraints of small but ultrahigh resolution fields of view, the alignment camera also allows image shifting in order to expand the visible image of a chip in x- and y-direction. This is useful when chip and substrate need to be aligned under maximum magnification and the chip’s fiducials exceed the field of view.

Additional visual information is also gained by the clever illumination concept which combines co-axial illumination and diffuse illumination. The co-axial illumination can be separately adjusted for chip and substrate, allowing for a perfect adaptation to specific conditions, i.e. the degree of surface reflections. The diffuse illumination provides additional image information, i.e. during alignment of components with bumpy structures and surfaces. Similar to the co-axial illumination, the light channels for chip and substrates can be individually adjusted to align structures and fiducials via overlay image.

For every working step, the optimal light values can be stored within the bonding software. When changing the bonding profile, the light settings are immediately available. Especially when working on applications with numerous sub-processes, such as assembly of complex hybrid systems, this solution results in a significantly improved workflow as manual light adjustment is no longer required.

Solutions to handling smallest components

Besides good vision, reliable manual alignment in the sub-micron range depends on precision engineering. Therefore, Finetech has developed a high planarity granite base plate. It enables a low-friction movement and rotation of the FINEPLACER® positioning table.  

The positioning table itself now has an option with optimized Z-travel guide. It is recommended for special applications that require a Z-shift of the substrate from focal plane to the placement plane after alignment. Digital micrometer screws provide 1 µm resolution for all axes.

For applications demanding highest accuracy, a new 50x50 mm² substrate heating option is available. Designed with water-cooled frame and special materials, it reliably keeps lateral drift of the substrate during temperature cycles in the sub-micron range, further adding to outstanding post-bond accuracy. 30 K/s fast heating allows for quick heating processes up to 450°C.

A new 45° dispenser support option for 3 cc and 5 cc cartridges allows dot dispensing of viscous media like adhesive, epoxy or solder between aligned components without compromising the alignment result. Tip lengths up to 1 inch are supported. The dispenser support supports touchdown and touchless modes and can accommodate all standard time-pressure dispensers.

A lot of innovation has gone into the chip handling at the placement arm. The vacuum based chip detection at the tool which is needed to trigger motorized placement and bonding processes now has an improved measuring method. Even particularly small, light and delicate chips can be detected in a very reliable way. In conjunction with adapted tooling, this enables secure handling of components as small as 100 x 100 µm² and below. An additional air purge option for the safe release of smallest components is available.

FINEPLACER® lambda – big ideas for smallest components

The ability to see fine structures and handle smallest components make the FINEPLACER® lambda an ideal fit for precision flip chip bonding, die attach and advanced packaging. This includes demanding applications like VCSEL / Photo Diode assembly, laser soldering, optical components packaging, multi-chip packaging, sensor assembly, or MEMS / MOEMS packaging.

Available in manual or motorized configurations, the device is the premier choice when maximum technological versatility and fast process implementation is required. Typical fields of application include R&D, universities, prototyping and low-volume production.

The system is capable of handling component sizes from 100 x 100 µm² to 15x15 mm² on a working area up to 190 mm x 52 mm. Wafer sizes up to 4" are supported. The FINEPLACER® lambda supports bond forces up to 400 N.

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