Automated Production of Complex Transceiver Modules
For the development and production of a particularly resilient transceiver module, Ultra Communications sought out Finetech’s high precision bonding equipment and experience with complex opto-electronics assembly.
Ultrasonic Flip Chip Bonding for Bilkent University UNAM
How Finetech assisted the National Nanotechnology Research Center (UNAM) in Turkey during the COVID-19 pandemic to retrofit and successfully deploy their existing FINEPLACER® system for a demanding ultrasonic flip-chip bonding application.
Automated Production of Diode Lasers for Medical, Industrial and Scientific Applications
With the help of a fully automated multi-chip bonder from Finetech, the Berlin-based laser specialists at Lumics have been able to improve reliability of their diode laser module manufacturing and to significantly increase production volume.
New possibilities in R&D of innovative MEMS sensors
Dr. Shih-Wei Lin from the Micro Device Laboratory at NTHU, Taiwan, relies on the sub-micron die bonder FINEPLACER® lambda 2 for the development of innovative micro sensors and actuators for IoT, mobile phones and smart X.
100% Rework Success for High Value SMD Components
How AEMtec uses advanced rework technology by Finetech to repair extremely valuable SMD assemblies worth as much as a car with a 100% success rate.
Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer.
Serving the Electronic Coast®
How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions.
Reworking Photodiode Arrays in the Manufacturing Process
How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors.
Automatic Packaging of Single Diode Lasers and Multi-Emitter Laser Modules
How Finetech supports a high power fiber laser manufacturer to implement high-accuracy assembly processes for in-house developed high power diode pumps and to transfer them from prototyping into automatic series production.
Top-tier Equipment for Top-tier Research
Finetech’s versatile flip-chip die bonder is contributing to optoelectronics research at the UK’s top engineering university.
Bright Examples of True Precision
How an Asian display manufacturer successfully improved its yield up to 100% in production of small SMD LED carrier boards by employing a Finetech-developed multi-stage rework process.
Qualified Rework of Challenging SMD Assemblies
EMS provider Mair Elektronik relies on FINEPLACER® systems for the rework of high-speed camera systems and other high-quality SMD assemblies.
High Power Laser Diodes by Quantel for Mars Rover Curiosity
High-power laser diodes by Quantel Laser help achieve important scientific tasks aboard Mars-exploring “Curiosity” rover. They were assembled on precision die bonders by Finetech.