Automated Production of Complex Transceiver Modules
For the development and production of a particularly resilient transceiver module, Ultra Communications sought out Finetech’s high precision bonding equipment and experience with complex opto-electronics assembly.
Ultrasonic Flip Chip Bonding for Bilkent University UNAM
How Finetech assisted the National Nanotechnology Research Center (UNAM) in Turkey during the COVID-19 pandemic to retrofit and successfully deploy their existing FINEPLACER® system for a demanding ultrasonic flip-chip bonding application.
New possibilities in R&D of innovative MEMS sensors
Dr. Shih-Wei Lin from the Micro Device Laboratory at NTHU, Taiwan, relies on the sub-micron die bonder FINEPLACER® lambda 2 for the development of innovative micro sensors and actuators for IoT, mobile phones and smart X.
Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer.
Reworking Photodiode Arrays in the Manufacturing Process
How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors.
Top-tier Equipment for Top-tier Research
Finetech’s versatile flip-chip die bonder is contributing to optoelectronics research at the UK’s top engineering university.
Qualified Rework of Challenging SMD Assemblies
EMS provider Mair Elektronik relies on FINEPLACER® systems for the rework of high-speed camera systems and other high-quality SMD assemblies.
