adhesive dispensed on chip

Adhesive Technologies

Author: n.n.

Abstract: Between two bonding partners such as die and substrate, adhesive materials can be applied in various ways: dispensing, stencil printing, pin transfer or as a film working as an intermediate connection. This technical paper gives an overview of different types of adhesives and associated adhesive technologies and describes typical properties and fields of application.

Document currently not available

We're on it. The document will be available soon. For urgent questions, get in touch with us today.

Your Sales Contact Thomas Müller

Finetech GmbH & Co. KG
Send an email

A free user account is needed

With a user account you can download:

  • product flyers
  • technical data sheets (after activation)
  • technical papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.