Bonding with Anisotropic Conductive Adhesive
Author: Ralph Schachler
Abstract: It’s hard to imagine a world without the ability to electrically connect flexible PCB to glass substrates. Flex‐On‐Glass is a preferred solution for most kinds of modern displays and can be found in smartphones, notebooks and flat screens just as much as in glass substrate based sensors, such as flat panel digital X‐ray detectors (FPXD). With ongoing miniaturization, chips are increasingly bonded directly to the glass (Chip‐On‐Glass). Usually, this goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials and also need to be processed differently. This technical paper gives an introduction to the technology, describes typical challenges and proven solutions.