How we measure accuracy
Author: Ralph Schachler, Martin Rogge, Tobias Gleichmann
Abstract: For assembly systems in packaging technology, so-called die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified.
This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified accuracy of Finetech products, but also those of other manufacturers.
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