Finetech https://www.finetech.de/news.rss en-gb Copyright Thu, 04 Mar 2021 10:30:50 +0100 Thu, 04 Mar 2021 10:30:50 +0100 news-204 Fri, 12 Feb 2021 09:01:40 +0100 Customer Story: Prototype-to-Production Assembly of Innovative Radiation Detection Products https://www.finetech.de/blog/detail/customer-story-prototype-to-production-assembly-of-innovative-radiation-detection-products/ Collaboration is one of the most important driving forces for continued growth in any business. Kromek, a leading developer of radiation detection products, has been able to meet its growth demand through an effective 20 years collaboration with Finetech and an assembly equipment pathway. Kromek is at the forefront of CZT (cadmium zinc telluride)-based radiation detector development, providing a way for medical device manufacturers to offer a scalable, modular solution for all quantitative SPECT (single-photon emission computed tomography) systems assembled into hand-held surgical cameras, thyroid imaging, molecular breast imaging, cardiac SPECT, preclinical or veterinary SPECT, and general-purpose whole-body SPECT. The change from conventional scintillator technology to CZT is like moving up from a black-and-white vacuum-tube television to a digital, high-definition, color flat-screen TV.  

Prototype-to-production assembly of array radiation detectors
John Eger, Process Engineer for Kromek, has had a nearly 20 year, long-term relationship with Finetech, installing his first 5 µm FINEPLACER® pico die bonder back in 2002.

The machine provided John the ability to prove out his concept through R&D to moderate production volume. As demand grew, the human limitations of repeatability and throughput, along with the need for higher accuracies, dictated a clear need for a new equipment solution. Finetech supported the transition to the fully-automated FINEPLACER® femto 2 bonder.

Kromek‘s volume assembly processes consist of epoxy dispense and picking and placing of multiple high density array radiation detectors with high precision. 
 

Read the full story

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news-202 Fri, 05 Feb 2021 14:33:01 +0100 Diverse and reliable assembly processes in development and production https://www.finetech.de/blog/detail/diverse-and-reliable-assembly-processes-in-development-and-production/ Finetech’s FINEPLACER® pico ma is a true laboratory die bonder with the virtues of a production system. A virtually unlimited range of functions, highly stable processes and up to 3 µm placement accuracy make the die bonder a cost-performance-leader. Around the world, the FINEPLACER® pico ma is the epitome of a flexible placement and die bonding system for demanding assembly tasks in prototyping, small series production, R&D labs and university purposes.

Thanks to its modular system architecture, the tabletop die bonder can be configured for a wide range of bonding technologies and applications. To meet new requirements, the system can be retrofitted and upgraded throughout its service life. With a FINEPLACER® pico ma die bonder you never have to settle and are well prepared for all eventualities.

Add to this the open, unobstructed design. Use all the freedom of the generous working area for precision assembly on particularly large substrates or expand the die bonding system with third-party functionalities. Your die bonder is capable of growing with your requirements and supports you in creative process design at all times.

With the virtues of a production die bonder
The FINEPLACER® pico ma combines this flexibility with the virtues of a genuine production die bonder. Despite manual process control, the FINEPLACER® pico ma die bonder stands for reproducibility and a high yield. Thanks to the high rigidity of the machine design and the high-resolution vision alignment system with fixed beam splitter, you always hit the target. In addition, all process modules and parameters such as temperature, time, force, flow and illumination are centrally controlled via the operating software. The integrated process management makes it particularly easy for you to focus on the core tasks in application development, to work in a structured manner and to minimize operating errors.

Whether in R&D or small volume production - the FINEPLACER® pico ma die bonder always gets straight to the point. Despite full access to all process parameters, the short setup and changeover times and the intuitive process creation save you valuable minutes of lab time every day, especially with frequently changing applications, and ensure high throughput. Numerous options for process traceability and documentation ensure common quality standards and support easy editing.

Higher placement accuracy on request
For working with particularly demanding product designs and assembly processes, the FINEPLACER® pico ma die bonder is also available with a placement accuracy of 3 µm instead of the usual 5 µm via the optionally available Zoom-Opticsplus.

Especially if you frequently work within very tight tolerances, the increased placement accuracy enables an extended process window and ensures more process reliability and yield. Thanks to the higher resolution, you can see alignment structures even more clearly and get more informative value in process documentation and in the evaluation of materials and surfaces. You have more leeway in process design and open up additional applications. Last but not least, you need to recalibrate the alignment accuracy of your die bonder less often and save further laboratory and development time.

Cost-performance-leader
With its economical operation, application flexibility as well as technological and functional diversity, the FINEPLACER® pico ma die bonder offers an outstanding return on investment. Thanks to its high process reproducibility in combination with the benefits of an optionally increased placement accuracy of up to 3 µm, the system can cover even demanding production tasks in addition to its traditional home in the R&D lab, as long as smaller quantities are manufactured and the switch to Finetech's fully automated solutions for high-volume production would be too early.

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news-200 Tue, 19 Jan 2021 17:16:40 +0100 Customer Story: Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy https://www.finetech.de/blog/detail/customer-story-die-bonder-for-the-stacking-of-membrane-chips-with-one-micron-post-bond-accuracy/ The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer. The Institute for Microelectronics Stuttgart (IMS Chips) is engaged in business-oriented research in the fields of silicon technology, application-specific circuits (ASIC), nanostructuring and image sensor technology and provides professional training. The institute partners with small and medium-sized enterprises, especially in the German federal state of Baden-Württemberg, and cooperates with leading international semiconductor companies and suppliers.

For a new application, key requirement was the stacking of a number of membrane chips, each several cm in size, on top of each other with very high precision. After completion of all placement and stacking steps, the post-bond accuracy of the overall process had to be less than 1 µm.

The previous system, an in-house design based on an old 3-inch mask aligner, reached its limits here due to a lack of spare parts and flexibility. For example, the lens distance could not be reduced, which limited the number of membranes which could be stacked on top of each other. The bonding force could not be controlled, which endangered the fragile membrane chips. Also, the adhesive for bonding the chips could not be applied in a defined manner and the overall process stability was not consistently given.

Therefore, IMS Chips were in the market for a new assembly system that would continue to ensure the highest assembly precision, but offer more flexibility in terms of supported substrate and component dimensions. The bonding force should be process-controlled and adjustable over a wide force range, and the system should also have the option of precisely applying adhesive with a dispenser.

Read the full story

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news-198 Mon, 19 Oct 2020 16:16:00 +0200 Customer Story: High-precision Die Bonder for the Electronic Coast® https://www.finetech.de/blog/detail/customer-story-high-precision-die-bonder-for-the-electronic-coastr/ How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions. With 20,000 students across eight locations, the State University of South-Eastern Norway (USN) is one the largest educational institutions in the country. Originating from a merger of three regional colleges, the university today offers a wide spectrum of bachelor, master and PhD courses in many scientific fields.

Besides their important role in domestic and international research and education, the USN is also traditionally deeply rooted in one of the most dynamic economic regions in the country. This is especially true for the Vestfold-based Department of Microsystems at the Faculty of Technology, Natural Sciences and Maritime Sciences, which has long been collaborating with local industrial partners in numerous R&D projects for innovations in microtechnology.
Under the Electronic Coast® brand, the USN together with close to three dozen member companies form an independent industrial association and expertise cluster, with the goal to strengthen the value creation and innovation in electronics and ICT-based companies in Vestfold and the region and to foster the development and commercialization of technology-based ideas.

Alongside the scientific perspective, the USN’s Department of Microsystems is the technological backbone, providing its partners with access to advanced lab facilities for microsystem technologies. A key element here: FINEPLACER® placement and assembly systems by Finetech.

 
It Started with a World’s First

Mr. Hoang-Vu Nguyen, Associate Professor at the Department of Microsystems, first learned about Finetech when visiting exhibitions at several packaging conferences in Europe and the US a couple of years back. He was impressed of the FINEPLACER®’s modular flexibility and ease of use. He thought it would be the perfect fit for his home lab and recommended the system to the department.

Read the full story

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news-196 Mon, 13 Jul 2020 15:47:00 +0200 Checklist - Which rework system fits your requirement profile? https://www.finetech.de/blog/detail/checklist-which-rework-system-fits-your-requirement-profile/ Are you a production or project manager of an OEM company or EMS service provider faced with the task of selecting a suitable rework system for professional SMD rework? In order to find the right solution that fits your individual requirements profile, there are numerous questions that should be addressed in advanced. This is especially important when taking into account the overwhelming market offerings.

As part of the evaluation, typical questions to consider include:

Why do you want to make an equipment investment? Is it a large individual project with consistent requirements or do you anticipate small, diverse projects with various components, substrates and materials?

Do you need a rework system with appropriate flexibility to keep all options open? Of course, technological considerations play a role, the keyword is future-proofing.
What market trends can you expect, which components/groups, substrate sizes and materials are you confronted with, which process specifications are you subject to?
The choice of the optimal heating technology is only the first of many decisions to be made.

An increasingly important issue is overall traceability and traceability of processes. If you want to be able to respond to your customers' questions, such as methodology used and how often a printed circuit board has been reworked, comprehensive documentation options are a must.

For large companies, central process development is also crucial. Can repair processes be set up once and then used throughout the company? Can it be ensured that the same results are reliably achieved on all systems?

Last but not least, there is the issue of possible internal resistance. At the end of the day, your operators must be comfortable and proficient working with the system, so ease-of-use and training are to be rated accordingly.

In order to understand the multitude of options on the market, it is best to assess in advance which type of rework system is ideally suited to your production or project requirements. This checklist, developed together with rework customers from different industries, outlines considerations for selecting your future system.

Get the full checklist

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news-185 Mon, 03 Feb 2020 14:51:52 +0100 Customer Story: The Core of Highly Flexible Rework https://www.finetech.de/blog/detail/customer-story-the-core-of-highly-flexible-rework/ Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications. Around the globe, Siemens locations rely on Finetech systems for rework of electronic components and high-accuracy semiconductor assembly. One of them is the long-established production site in Fürth Hardhöhe, Germany. For decades, this Siemens facility has been producing electronic components, standardized and customer-specific modules and complete systems for industrial use, i.e. control and automation technology, as well as medical and energy technology.

The wide spectrum of different electronics manufactured in Fürth is unique in the realm of Siemens. It requires highly versatile production facilities, and also a very flexible approach to reworking manufacturing-related error cases at the production environment level. Not least, the rework results have to be extremely reliable, as Siemens offers its industrial customers a warranty of up to 25 years on electronic components.

However, reworking very small components and assemblies on densely populated printed circuit boards is particularly demanding. The infrared heating technology previously used by Siemens had reached its limits with regard to optimum heat distribution, so Siemens was looking for a partner that could offer a state-of-the-art solution.

Read the full story

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news-184 Wed, 29 Jan 2020 07:47:48 +0100 Finetech Presents at MIT’s Integrated Photonics Bootcamp https://www.finetech.de/blog/detail/finetech-presents-at-mits-integrated-photonics-bootcamp/ On January 17, Finetech participated in Massachusetts Institute of Technology's (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience at the MIT.nano facility.  The training allows participants to explore and learn to solve problems using lab equipment, preparing them for the challenges they will face in the workforce. The session covered precision bonding fundamentals: optics, die and substrate temperature, alignment tolerances, thermal mismatch, inert atmosphere, and force.  A review of bonding technologies included thermo-compression and thermo-sonic bonding, and UV adhesive cure.

Finetech provided a demonstration of flip-chip bonding using the FINEPLACER® lambda bonder.  Participants learned about one of the most critical bonds in a complex surface mount photonic device: the assembly of QFN low-profile quad transceiver modules using thermo-compression bonding of a VCSEL onto a sapphire substrate.  Each student had an opportunity to “drive” the equipment to get a feel for the sub-micron placement accuracy of the system.  

Anuradha (Anu) Agarwal, Principal Research Scientist at the MIT Materials Research Laboratory and Leader of the LEAP (Lab for Education and Application Prototypes) Program, was a bootcamp instructor and instrumental in organizing the program.  Following the event, Anu stated, “The Finetech team highlighted the ability of the FINEPLACER® lambda tool in achieving the desired accuracy for mounting III-V based laser dies onto an opto-electronic silicon chip. This is something desirable as we move forward with integrated photonics packaging. MIT values Finetech’s partnership in education, as we train (or re-skill) people for next generation jobs in manufacturing. We look forward to more such educational opportunities with them in the future.”

Indium Corporation, a materials manufacturer and supplier, partnered with Finetech to talk about the chemistries and physical properties of bonding materials, and the importance of using that information to select the right materials for their application. “We were pleased to have the opportunity to partner with Finetech and MIT for this event. It provided us with the opportunity to educate students and industry participants, and to learn more about Finetech equipment capabilities and the specific materials needs of the photonics industry,” said Andy Mackie, Senior Product Manager at Indium Corporation.

The general feedback from the participants was how fascinating it was to see and align such small features.  Most couldn’t wait to get their hands on the machine and try the alignment process.

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news-180 Tue, 07 Jan 2020 09:37:12 +0100 Customer Story: Reworking Photodiode Arrays in the Manufacturing Process https://www.finetech.de/blog/detail/customer-story-reworking-photodiode-arrays-in-the-manufacturing-process/ How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors. In the growing sensor market, First Sensor AG develops and produces standardized and customer-specific solutions for numerous applications. Based on proven technology platforms, a wide range of products are developed, from chips to components and detectors to sensor systems. Among other things, First Sensor is a strategic partner for leading medical device manufacturers in the field of medical diagnostics. Here, imaging procedures such as endoscopy, computed tomography (CT) scans and magnetic resonance imaging (MRI) play an important role in the identification of diseases and functional disorders and what causes them.

Read full story

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news-172 Tue, 20 Aug 2019 16:16:54 +0200 With Sub Micron Accuracy from Lab to Fab https://www.finetech.de/blog/detail/with-sub-micron-accuracy-from-lab-to-fab/ Finetech's high-precision placement and assembly systems support customers from the photonics and optoelectronics industry in cost-efficient product development and transfer to automated manufacturing. With the newly introduced FINEPLACER® lambda 2 and the high-yield production platform FINEPLACER® femto 2, the Berlin-based precision machine manufacturer offers integrated equipment and process solutions for all product stages from a single source. As a manufacturer of micro assembly equipment and process technology, Finetech has been supporting start-ups, as well as global technology leaders, for almost three decades in the development of innovative semiconductor products. The highly accurate sub-micron placement and assembly systems are a cornerstone of the Berlin-based mechanical engineering company's portfolio - valued worldwide as versatile, cost-efficient and compact bonding platforms for R&D, prototyping and automated production.

They are the first choice for complex multi-stage assemblies with extremely high accuracy requirements, as well as diverse and very demanding bonding technologies. Applications include the development and production of optical transceivers up to 400 G for data communication, environmental sensors for autonomous driving, or power laser modules for use in industrial and medical applications.

FINEPLACER® lambda 2 - the starting point for successful product development
For basic research, concept and prototype phases, Finetech offers manual and partially motorized table-top systems. For this segment Finetech recently presented a new version of its long-standing successful model, the FINEPLACER® lambda.

The FINEPLACER® lambda 2 is used to place and connect components with an accuracy of better than 0.5 microns - ideal for the high requirements, e.g. in the development of opto-electronic products such as transceivers (TOSA/ROSA) or laser diode modules.

Thanks to the proven FINEPLACER® alignment and placement principle with only one moving axis, the system combines highest process quality, stability and accuracy. In conjunction with specially developed optical systems with an optical resolutions down to 0.7 µm, it enables superimposed images of the highest optical quality for the reliable detection and alignment of finest structures in the micron range.

Focus on the user
During the development of the FINEPLACER® lambda 2, Finetech put particular emphasis on the user's needs. Thanks to the ergonomic machine design and software-supported guidance, the user always remains at the center of the action.

For greater comfort and safety, all operating elements have been adapted to the typical workflow. This allows the user to concentrate on the essentials and quickly obtain results. The uniform operating concept with clearly structured process sequences also ensures quick familiarization.

The library-based toolbox design of the newly developed IPM Command operating software simplifies the preparation and modification of process sequences. Instead of predefined scripts, the user can freely create, modify and combine sequences. The visual representation of all process components and parameters in real time enables intuitive and efficient process design.

Thanks to the intelligent user guidance, user errors are minimized.

Automated processes with the FINEPLACER® femto 2
Placement and assembly processes can be automated quickly and easily on Finetech equipment. The FINEPLACER® femto 2 maintains the level of reproducibility and accuracy of the processes developed on the FINEPLACER® lambda 2, while at the same time integrating the automatic handling and process steps required for series production.

The automatic bonding platform offers placement accuracy down to 0.3 micron @ 3 Sigma and supports a wide range of assembly applications at chip and wafer level. Designed for complex applications with highest accuracy requirements and a diverse technology mix, the system is suitable for automated development environments, as well as high-yield manufacturing of high-quality semiconductor products.

The Vision Alignment System FPXVisionTM allows cost- and time-efficient passive optical placement of devices. In combination with a powerful pattern recognition, it opens up numerous possibilities for the user in terms of application flexibility and accuracy.

The FINEPLACER® femto 2 has a special housing to eliminate external interference factors and to precisely control and influence the process conditions. Filter technology ensures a protected process environment in cleanroom quality up to class 100/ISO 5 - regardless of the machine's location.

Flexibility and compatibility
Both FINEPLACER® systems follow Finetech's uniform software concept IPM Command and share the same process module base. In this way, processes which have been already qualified during the development phase can be transferred to automation without technology change or changeover effort and scaled for production.

Like all FINEPLACER® bonding systems, the machines support individual configurations. The modular architecture of the platform makes it possible to equip the machine with a multitude of extension modules for a wide range of assembly and bonding technologies, including eutectic soldering, thermocompression bonding or bonding with UV-curing adhesives. This technological diversity opens up a wide range of applications, which can be further expanded by the large bonding force range.

Thanks to the modular system architecture, the systems remain adaptable at any time: if the technology requirements change, the corresponding process module can be retrofitted by the user via plug & play.

Process development and automated production cannot be more flexible; at the same time follow-up costs are kept low and the investment is safeguarded even with changing application requirements. Ideal scenario for users who frequently want to implement new technologies and processes in the long term.


Both systems will be exhibited at Productronica 2019, hall B2, booth 411

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news-169 Fri, 02 Aug 2019 08:48:24 +0200 Neuralink using Finetech bonder for packaging development work https://www.finetech.de/blog/detail/neuralink-using-finetech-bonder-for-packaging-development-work/ Neuralink is a neurotechnology company that’s developing implantable, ultra-high bandwidth brain–machine interfaces (BMI) to connect humans and computers.  Neuralink’s approach to BMI involves unprecedented packaging density and scalability in a clinically relevant package. The exciting and rapid advances Neuralink has made over the past couple of years has been aided by the accelerated delivery time of a Finetech precision bonder, capable of bonding die with accuracies of 0.5 µm.  Finetech recognizes Neuralink to be one of the most compelling startup companies of the last decade.

The FINEPLACER® bonders have become the “go to” solution for dozens of startup companies to create innovative products that require a pathway from prototyping to production. “Simply Accurate” is not just our company slogan, it’s a capability that assists in the development of many novel technologies.


“The ability to have a turnkey solution for our high precision die bonding is critical for us. Not only has Finetech provided this, but they’ve done so with speed and outstanding support” – Vanessa Tolosa, Neuralink

To learn more about Neuralink’s technology, watch the July 16 press conference that outlines their plans

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news-166 Mon, 06 May 2019 10:39:19 +0200 New Sub-Micron Bonder FINEPLACER® lambda 2 to Make European Debut https://www.finetech.de/blog/detail/new-sub-micron-bonder-fineplacerr-lambda-2-to-make-european-debut/ At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and development. Technological innovations make the high-precision placement and assembly system the ideal starting point for cost-efficient and fast development of optoelectronic products. As a manufacturer of micro assembly equipment and process technology, Finetech has been supporting start-ups as well as global technology leaders in the development of innovative semiconductor products for more than two decades. The FINEPLACER® lambda - the worldwide epitome of a versatile, high-precision and compact R&D die bonding system with an unrivaled price/performance ratio - is a cornerstone in Finetech’s product line-up.

At Laser World of Photonics, the Berlin-based company presents the successor of this successful model. The FINEPLACER® lambda 2 continues the virtues of its predecessor and sets new benchmarks in optoelectronics assembly.

High-precision placement and assembly
With the FINEPLACER® lambda 2, components can be placed and bonded with an accuracy of better than 1 micrometer - ideal for the high requirements, e.g. in the development of opto-electronic products such as transceivers (TOSA/ROSA) or laser diode modules.

Thanks to the proven FINEPLACER® alignment and placement principle with only one moving axis, the system provides highest process quality, stability and accuracy. In combination with specially developed interchangeable optics with a resolution of down to 0.7 µm, it enables overlaying images of the highest optical quality. Even finest structures in sub-micrometer range can be reliably detected and aligned. For each application, the user can choose between different image field sizes to ensure optimum viewing conditions for all supported component dimensions.

Modularity for flexible use
The completely revised bonding platform is still available in manual or semi-motorized configurations and can now be equipped even more conveniently with a variety of extension modules for very different assembly and bonding technologies, including eutectic soldering, thermocompression bonding or bonding with UV-curing adhesives. 
This technological diversity opens up a particularly wide range of applications, which can be further extended by a large bonding force range.

Thanks to the modular system architecture, the machine always remains flexible: if, for example, applications are to be bonded with ultrasound at a later point in time, the required process module can simply be retrofitted by the user himself via plug & play.

Process development cannot be more flexible, at the same time follow-up costs are kept low and the future security of the investment is guaranteed even with changing application requirements. That makes the FINEPLACER® lambda 2 the ideal proposal for users in education, research and development who continually need to implement new and adapted technologies and processes.

Focus on the user
During the development of the FINEPLACER® lambda 2, Finetech has consistently focused on the needs of the user. Thanks to the ergonomic machine design and software-assisted user guidance, the operator always remains at the center of action. 

For greater comfort and safety, all operating elements have been adapted to typical work sequences. This allows the user to focus on the essentials and achieve results in no time. The uniform operating concept with clearly structured process sequences also ensures a quick familiarization with the machine. 

The library-based toolbox design of the newly developed IPM Command operating software simplifies the setup and modification of process sequences. Instead of predefined scripts, the user can freely create, modify and combine sequences. The visual representation of all process components and parameters in real time enables an intuitive and efficient process design. 

Due to the intelligent user guidance, user errors can be minimized.

Starting point for product development
With IPM Command, the FINEPLACER® lambda 2 also follows Finetech's integrated software concept. Whether prototyping device or production system - all new FINEPLACER® machines are based on the same software platform. Processes created and certified during the development phase can be quickly and easily transferred to Finetech's automated production systems. This enables a seamless transition from development to series production and a fast ramp-up of production.

With sub-micron accuracy from development to series production. The FINEPLACER® lambda 2 is the ideal starting point for successful product development in optoelectronics.

Finetech at the Laser World of Photonics in Munich
The European premiere of the new FINEPLACER® lambda 2 will take place from 24 to 27 June 2019 at the Laser World of Photonics in Munich, hall B2, booth 212.
 

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news-149 Wed, 19 Sep 2018 11:42:01 +0200 Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies https://www.finetech.de/blog/detail/stanford-nanofabrication-facility-partners-with-finetech-on-die-bonding-technologies/ GILBERT, AZ (September 18, 2018) – Finetech, a global supplier of micro-assembly equipment, is pleased to have recently formed a partnership with the Stanford Nanofabrication Facility (SNF) located in the newly opened Paul. G Allen Building in Stanford, California.  The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab’s equipment capabilities, accommodating the evolving research needs of its lab members. This collaboration enhances the support and availability of Finetech's technical knowhow, thereby enabling innovative solutions and strengthening the position of Finetech tools in leading edge research.
SNF is a vibrant research community where users work in areas that cover a wide range of disciplines, such as optics, MEMS, biology, chemistry, as well as the more traditional areas of electronics device fabrication and process characterization/development.  Having the bonder in the facility provides Finetech a resource by having access to a highly respected Silicon Valley research nanofabrication lab.
Dr. Usha Raghuram, SNF senior tech staff says, “The addition of this bonder to our lab has filled in a much needed gap for bonding between small substrates, with superior alignment accuracy.  The simplicity to configure and use makes the bonder a perfect fit for students looking to further their developments and inventions.”   

The FINEPLACER® Lambda is an ideal addition for process development with high accuracy requirements. The machine was designed with particular attention to the needs of laboratory environments.  This includes a high degree of configurability for flexible integration of packaging technologies, as well as fast process setup times and immediate operation. The latest version of the system comes with a number of innovations that address the challenges of working with ultra-small components.

“Having a partnership with one of the most prestigious universities in the United States is an honor,” said Robert Avila, Sales Manager, Finetech. “We value our partnership with SNF and look forward to many years of collaboration with SNF on these micro- and nano-bonding applications.” 

About Stanford Nanofabrication Facility
The Stanford Nanofabrication Facility is a member of the National Nanotechnology Coordinating Infrastructure (NNCI), a consortium of 16 academic shared-use facilities providing R&D resources to industrial, government, and academic researchers, across the country. The NNCI provides a platform for sharing expertise as well as resources and thus broadens the scope of tools available to lab members.
SNF supports researchers in applications ranging from medicine and biology to fundamental physics and astronomy, exploring uses of micro- and nano- fabrication. https://snf.stanford.edu 
 

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news-132 Mon, 26 Mar 2018 11:33:39 +0200 Finetech to host Micro Assembly Day https://www.finetech.de/blog/detail/finetech-to-host-micro-assembly-day/ On May 17, 2018, Berlin-based machine supplier Finetech will host a new edition of the popular “Micro Assembly Day” series. This recurring one-day conference highlights current challenges and solutions in micro assembly and advanced packaging. The event brings together customers and prospects from science and industry for an exchange of experience and is an excellent platform to share ideas and inspire new and exciting projects. In its previous edition, the Micro Assembly Day attracted more visitors than ever from all over Europe.

The Micro Assembly Day 2018 offers sessions on some of today’s hottest market trends. In addition, high-profile speakers will report on scientific advances in developing innovative assembly and packaging technologies. This year, the participants will also get an exclusive preview of new product developments for Finetech's die bonder division for R&D and production.

The day before, on May 16, all participants are invited to join a get-together dinner at the Berlin Humboldt Box roof top restaurant and kick off the Micro Assembly Day in a relaxed atmosphere.

Individual consultations on Friday
Following a good tradition, the day after the conference can be used for individual consultations with the Finetech specialists. Interested visitors can also participate in hands-on sessions for a first-hand experience of Finetech’s die bonder systems.

Preliminary agenda and registration.

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news-59 Sun, 19 Nov 2017 15:18:00 +0100 Finetech Presents Production Equipment at Productronica 2017 https://www.finetech.de/blog/detail/finetech-presents-production-equipment-at-productronica-2017/ With two booths at Productronica 2017 in Munich, Finetech presented new product highlights for Advanced Packaging and SMD-Rework and attracted more visitors than ever. In the year of the 25th anniversary, Finetech could celebrate not one but two product premieres – FineXT 6003 and FineXT 5205. These brand-new fully-automated production cells are targeted at customers looking to transfer their developed prototypes into series production. For this, both machines strike a balance between optimized throughput, high placement accuracy and process flexibility. Primarily designed for the manufacturing of sensors, MEMS/MOEMS, optical transceivers, Active Optical Cables and Planar Lightwave Circuits, Finetech’s new production systems can be flexibly configured to support a diverse spectrum of applications and technologies.

For Finetech, the step towards production equipment marks the begin of a new era. By expanding their product portfolio, Finetech can now offer its customers a consistent line of compatible machine solutions from product development to series production. Certified assembly processes created in the R&D stages can be easily transmitted and scaled according the requirements of full production environments.

By providing everything from one source, Finetech ensures customers get access to very time- and cost efficient product development and production – with 100% compatible processes and minimal conversion expenses.  During numerous talks at Productronica 2017, many visitors already acknowledged the potential and benefits of this approach and were curious to learn more about the new FineXT product family.

Finetechs automated die bonder division at Productronica were completed by the FINEPLACER® femto 2, a sub-micron die bonder for development and production. Designed for complex applications with highest accuracy requirements and a diverse mix of bonding technologies, the system is suited for demanding prototyping tasks as well as high yield production of sophisticated semiconductor products.

 

Vacuum bonding and in-situ parallelism control

Apart from production equipment, Finetech also presented some product news for the R&D die bonders. One of the highlights was the new Vacuum Bonding Module for the FINEPLACER® sigma, which enables to perform the whole spectrum of assembly and packaging technologies under vacuum. Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation, e.g. Indium, or for applications requiring extra reliability and stable connections, e.g. power electronics.

Another highlight on display was a new FINEPLACER® extension module for parallelism control during bonding. It was specifically developed for applications where large-area components with thousands of small contacts, e.g. IR sensors or pixel detectors, need to be bonded. In order to function properly, an absolutely coplanar attachment is mandatory. However, with bump sizes as small as 5 micron this can be a real challenge. The new Finetech solution allows for an in-situ coplanarity measuring and readjustment during bonding, ensuring a 100% homogenous attachment of all contacts/bumps across the entire component surface.

 

Thank you to all visitors

Never before had so many visitors from such a diverse range of industries visited Finetech at a Productronica show. Naturally, the newly introduced production equipment drew a lot of attention, but also the manual assembly systems as well as hot gas SMD rework solutions were met with great interest.

Finetech says thank you to all visitors and will continue to be an innovative and strong technology partner for high-precision assembly and rework tasks in research, development, and production.

Finetech is organizing another Micro Assembly Day in May 2018, the registration will start in February. Get further information under Micro Assembly Day (MADAY)

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news-45 Thu, 26 Oct 2017 11:32:00 +0200 Germany@CERN – Finetech Presents Vacuum Die Bonding Solutions https://www.finetech.de/blog/detail/germanycern-finetech-presents-vacuum-die-bonding-solutions/ On October 10-11, 2017, Finetech participated in the Germany@CERN exhibition in Meyrin, Switzerland. The event which is organized by CERN and the Federal Ministry of Education and Research (BMBF) was created to initiate new cooperations between CERN facilities and German companies as well as to enhance existing partnerships. Whether scientists are looking for neutrinos, measuring cosmic radiation or trying to find the smallest known particles in the universe –the fundamental research conducted at CERN often anticipates technological developments, constantly pushing the limits of what technology can do today.

The number of German technologies currently in use at CERN might be an indicator that German companies are well equipped to meet those challenges. Together with universities and research institutions, they test innovative manufacturing methods and technologies contributing to the success of international research projects.

With its portfolio of high-precision FINEPLACER® placement and assembly systems, Finetech has been a long-time equipment supplier to various European CERN project partners doing research in the field of particle physics. Detector panels assembled on FINEPLACER® systems are currently used in the world’s largest particle accelerator, aptly named the Large Hadron Collider.

This year, Finetech put the focus on vacuum die bonding solutions which provide a number of exciting possibilities for fundamental research.

The Vacuum Chamber Module can be easily integrated into a FINEPLACER® system. While retaining full flexibility with regard to assembly technology, placement accuracy, force and temperature, bonds made in vacuum are free from voids and packages can be hermetically sealed. Vacuum-bonded assemblies are particularly durable, resilient and have excellent electric/thermal conductivity, a prerequisite to design miniaturized components and better-performing modern electronic and opto-electronic micro systems.

Highlight of this year’s event was a visit by the CERN Director-General, Fabiola Gianotti, together with BMBF representatives. Ms. Gianotti, an experimental particle physicist herself, showed great interest in hearing more about Finetech’s contributions in this field.

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