Finetech en-gb Copyright Sat, 15 Dec 2018 00:00:55 +0100 Sat, 15 Dec 2018 00:00:55 +0100 news-149 Wed, 19 Sep 2018 11:42:01 +0200 Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies GILBERT, AZ (September 18, 2018) – Finetech, a global supplier of micro-assembly equipment, is pleased to have recently formed a partnership with the Stanford Nanofabrication Facility (SNF) located in the newly opened Paul. G Allen Building in Stanford, California.  The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab’s equipment capabilities, accommodating the evolving research needs of its lab members. This collaboration enhances the support and availability of Finetech's technical knowhow, thereby enabling innovative solutions and strengthening the position of Finetech tools in leading edge research.
SNF is a vibrant research community where users work in areas that cover a wide range of disciplines, such as optics, MEMS, biology, chemistry, as well as the more traditional areas of electronics device fabrication and process characterization/development.  Having the bonder in the facility provides Finetech a resource by having access to a highly respected Silicon Valley research nanofabrication lab.
Dr. Usha Raghuram, SNF senior tech staff says, “The addition of this bonder to our lab has filled in a much needed gap for bonding between small substrates, with superior alignment accuracy.  The simplicity to configure and use makes the bonder a perfect fit for students looking to further their developments and inventions.”   

The FINEPLACER® Lambda is an ideal addition for process development with high accuracy requirements. The machine was designed with particular attention to the needs of laboratory environments.  This includes a high degree of configurability for flexible integration of packaging technologies, as well as fast process setup times and immediate operation. The latest version of the system comes with a number of innovations that address the challenges of working with ultra-small components.

“Having a partnership with one of the most prestigious universities in the United States is an honor,” said Robert Avila, Sales Manager, Finetech. “We value our partnership with SNF and look forward to many years of collaboration with SNF on these micro- and nano-bonding applications.” 

About Stanford Nanofabrication Facility
The Stanford Nanofabrication Facility is a member of the National Nanotechnology Coordinating Infrastructure (NNCI), a consortium of 16 academic shared-use facilities providing R&D resources to industrial, government, and academic researchers, across the country. The NNCI provides a platform for sharing expertise as well as resources and thus broadens the scope of tools available to lab members.
SNF supports researchers in applications ranging from medicine and biology to fundamental physics and astronomy, exploring uses of micro- and nano- fabrication. 

news-132 Mon, 26 Mar 2018 11:33:39 +0200 Finetech to host Micro Assembly Day On May 17, 2018, Berlin-based machine supplier Finetech will host a new edition of the popular “Micro Assembly Day” series. This recurring one-day conference highlights current challenges and solutions in micro assembly and advanced packaging. The event brings together customers and prospects from science and industry for an exchange of experience and is an excellent platform to share ideas and inspire new and exciting projects. In its previous edition, the Micro Assembly Day attracted more visitors than ever from all over Europe.

The Micro Assembly Day 2018 offers sessions on some of today’s hottest market trends. In addition, high-profile speakers will report on scientific advances in developing innovative assembly and packaging technologies. This year, the participants will also get an exclusive preview of new product developments for Finetech's die bonder division for R&D and production.

The day before, on May 16, all participants are invited to join a get-together dinner at the Berlin Humboldt Box roof top restaurant and kick off the Micro Assembly Day in a relaxed atmosphere.

Individual consultations on Friday
Following a good tradition, the day after the conference can be used for individual consultations with the Finetech specialists. Interested visitors can also participate in hands-on sessions for a first-hand experience of Finetech’s die bonder systems.

Preliminary agenda and registration.

news-59 Sun, 19 Nov 2017 15:18:00 +0100 Finetech Presents Production Equipment at Productronica 2017 With two booths at Productronica 2017 in Munich, Finetech presented new product highlights for Advanced Packaging and SMD-Rework and attracted more visitors than ever. In the year of the 25th anniversary, Finetech could celebrate not one but two product premieres – FineXT 6003 and FineXT 5205. These brand-new fully-automated production cells are targeted at customers looking to transfer their developed prototypes into series production. For this, both machines strike a balance between optimized throughput, high placement accuracy and process flexibility. Primarily designed for the manufacturing of sensors, MEMS/MOEMS, optical transceivers, Active Optical Cables and Planar Lightwave Circuits, Finetech’s new production systems can be flexibly configured to support a diverse spectrum of applications and technologies.

For Finetech, the step towards production equipment marks the begin of a new era. By expanding their product portfolio, Finetech can now offer its customers a consistent line of compatible machine solutions from product development to series production. Certified assembly processes created in the R&D stages can be easily transmitted and scaled according the requirements of full production environments.

By providing everything from one source, Finetech ensures customers get access to very time- and cost efficient product development and production – with 100% compatible processes and minimal conversion expenses.  During numerous talks at Productronica 2017, many visitors already acknowledged the potential and benefits of this approach and were curious to learn more about the new FineXT product family.

Finetechs automated die bonder division at Productronica were completed by the FINEPLACER® femto 2, a sub-micron die bonder for development and production. Designed for complex applications with highest accuracy requirements and a diverse mix of bonding technologies, the system is suited for demanding prototyping tasks as well as high yield production of sophisticated semiconductor products.


Vacuum bonding and in-situ parallelism control

Apart from production equipment, Finetech also presented some product news for the R&D die bonders. One of the highlights was the new Vacuum Bonding Module for the FINEPLACER® sigma, which enables to perform the whole spectrum of assembly and packaging technologies under vacuum. Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Hermetic sealing is taken to the next level, void density is significantly reduced, and materials and processes can be studied in a near oxygen-free environment. Advantageous for materials prone to oxidation, e.g. Indium, or for applications requiring extra reliability and stable connections, e.g. power electronics.

Another highlight on display was a new FINEPLACER® extension module for parallelism control during bonding. It was specifically developed for applications where large-area components with thousands of small contacts, e.g. IR sensors or pixel detectors, need to be bonded. In order to function properly, an absolutely coplanar attachment is mandatory. However, with bump sizes as small as 5 micron this can be a real challenge. The new Finetech solution allows for an in-situ coplanarity measuring and readjustment during bonding, ensuring a 100% homogenous attachment of all contacts/bumps across the entire component surface.


Thank you to all visitors

Never before had so many visitors from such a diverse range of industries visited Finetech at a Productronica show. Naturally, the newly introduced production equipment drew a lot of attention, but also the manual assembly systems as well as hot gas SMD rework solutions were met with great interest.

Finetech says thank you to all visitors and will continue to be an innovative and strong technology partner for high-precision assembly and rework tasks in research, development, and production.

Finetech is organizing another Micro Assembly Day in May 2018, the registration will start in February. Get further information under Micro Assembly Day (MADAY)

news-45 Thu, 26 Oct 2017 11:32:00 +0200 Germany@CERN – Finetech Presents Vacuum Die Bonding Solutions On October 10-11, 2017, Finetech participated in the Germany@CERN exhibition in Meyrin, Switzerland. The event which is organized by CERN and the Federal Ministry of Education and Research (BMBF) was created to initiate new cooperations between CERN facilities and German companies as well as to enhance existing partnerships. Whether scientists are looking for neutrinos, measuring cosmic radiation or trying to find the smallest known particles in the universe –the fundamental research conducted at CERN often anticipates technological developments, constantly pushing the limits of what technology can do today.

The number of German technologies currently in use at CERN might be an indicator that German companies are well equipped to meet those challenges. Together with universities and research institutions, they test innovative manufacturing methods and technologies contributing to the success of international research projects.

With its portfolio of high-precision FINEPLACER® placement and assembly systems, Finetech has been a long-time equipment supplier to various European CERN project partners doing research in the field of particle physics. Detector panels assembled on FINEPLACER® systems are currently used in the world’s largest particle accelerator, aptly named the Large Hadron Collider.

This year, Finetech put the focus on vacuum die bonding solutions which provide a number of exciting possibilities for fundamental research.

The Vacuum Chamber Module can be easily integrated into a FINEPLACER® system. While retaining full flexibility with regard to assembly technology, placement accuracy, force and temperature, bonds made in vacuum are free from voids and packages can be hermetically sealed. Vacuum-bonded assemblies are particularly durable, resilient and have excellent electric/thermal conductivity, a prerequisite to design miniaturized components and better-performing modern electronic and opto-electronic micro systems.

Highlight of this year’s event was a visit by the CERN Director-General, Fabiola Gianotti, together with BMBF representatives. Ms. Gianotti, an experimental particle physicist herself, showed great interest in hearing more about Finetech’s contributions in this field.

news-38 Thu, 05 Oct 2017 11:07:22 +0200 FINEPLACER® femto 2 - Automatic Sub Micron Bonder for Product Development and Production At Productronica 2017, Finetech is going to present the automatic bonding platform FINEPLACER® femto 2. The system features a placement accuracy of up to ± 0.5 µm @ 3 Sigma and supports a wide range of assembly applications at chip and wafer level. The FINEPLACER® femto 2 is suitable for clients from various branches, including industrial semiconductor, data communications, medical technologies, automotive, avionics and aerospace, as well as universities and research organizations. For many years, Finetech’s FINEPLACER® femto platform has been a reliable tool as applications migrate from process and product development to automated high-mix product environments with the focus on optimal yield. The whole production chain can be followed, from inspection to characterization, packaging, final test and classification.

The FINEPLACER® femto 2 is already successfully employed in fields of application as diverse as the development of environmental sensors for autonomous driving, power lasers for medical and cosmetic purposes, detector sensors used in particle physics or modules for photolithographic wafer exposure during semiconductor manufacturing.

Configurations for applications of any kind

Typical applications of the FINEPLACER® femto 2 are characterized by complex multi-stage assembly processes of very small or very large components, particularly high accuracy requirements as well as flexible and demanding combinations of various bonding technologies.

Like all bonding systems by Finetech, the FINEPLACER® femto 2 can be individually configured. Its modular architecture allows retrofitting the platform at any time according to the requirements of added applications and technologies.

Numerous technical innovations

The new generation of the femto-platform expands the proven technical base of the previous model with many improvements.

Finetech has equipped the FINEPLACER® femto 2 with a special machine enclosure. By eliminating external factors of interference, all process conditions can be precisely controlled and directly influenced. By means of filtration a safe process environment in cleanroom quality is achieved –regardless of the machine's operating site.

The Vision Alignment System FPXVisionTM  was especially designed for particularly high precision requirements. Together with the improved pattern recognition it provides the user with extended possibilities regarding application flexibility and precision.

Also, the innovative bonding and control software IPM Command has been completely revamped from the ground up. It allows for a logical and clearly structured process development on a modular library-based principle and is particularly easy to use.

Live at Productronica 2017

The FINEPLACER® femto 2 will be presented during Productronica 2017 in Munich from November 14th to 17th. All interested visitors may stop by the Finetech Micro Assembly booth #B2/411 for a first-hand experience of the automatic die bonder platform.

news-37 Thu, 05 Oct 2017 10:56:00 +0200 Rework Solutions for all Applications At Productronica 2017, Finetech together with MARTIN is presenting a comprehensive portfolio of rework solutions for the whole SMD spectrum. On booth #A4/181, which is devoted exclusively to the company's rework branch, showcased products include professional universal systems as well as individually configured special solutions for advanced rework challenges. Live on display will be the FINEPLACER® core, a versatile hot air rework station for professional SMD rework. The FINEPLACER® core is a universally applicable soldering system for the rework of electronic components and assemblies according to IPC/JEDEC. The whole rework cycle can be carried out on the compact rework system, starting from de-soldering the component through site cleaning, reballing and dispensing to soldering the new component. The spectrum of compatible SMD devices ranges from very small components (01005) to large BGAs.

The optionally available Dispenser Module RD3C can apply glue, flux and solder accurately and precisely dosed. By integrating the working step “Dispensing”, the applicability and versatility of the machine is further expanded. This includes, for instance, the application of solder or conductive adhesive onto small passive 01005 SMD components or LED components. For leadless components like QFN with only few contact pads, applying solder by means of a dispenser is a fast, affordable and flexible alternative to stencil printing. Another application of the machine can be the precision underfilling of BGA or CSP with epoxy material.

Depending on the requirements the customer can choose between a local bottom heating for small-format circuit boards (e.g. cellphones, navigation systems, micro PC’s, hearing aids) and a full-area bottom heating optimized for medium-sized circuit boards (e.g. tablets, laptops, game consoles).

The intuitive operating concept of the FINEPLACER® core together with a comprehensive pre-installed process library and graphical user guidance allow taking up work quickly. Extensive professional functions like digital calibration of the top heating, precise control of the touchdown force and live process observation make FINEPLACER® core a future-proof investment when the demands get tougher.

The FINEPLACER® core is successfully used in R&D, process development, prototyping or manufacturing environments. Due to its system-to-system process transfer capability, processes can be centrally created and administrated and later be used on different systems with identical results.

news-2 Tue, 18 Jul 2017 15:35:00 +0200 Finetech Celebrates its 25th Anniversary Berlin-based, high-precision equipment manufacturer Finetech turns 25. What began as a small start-up in 1992, is today a globally operating manufacturer of placement and assembly systems, helping technology start-ups and industry leaders worldwide to develop and produce trendsetting semiconductor products. At Finetech’s anniversary party, the entire team and guests celebrated this German success story. On June 24th, company employees and visitors from around the world raised a glass to Finetech’s 25th anniversary. With the company’s history stretching back a quarter century now, the party location in the historical setting of the Berlin-Hoppegarten horse racing track was a perfect fit. While everyone enjoyed themselves with live music and many attractions for young and old, a dazzling laser show closed the evening and was the cherry on the birthday cake, recalling important milestones and facts in the Finetech history.

During his speech, Finetech CEO Gunter Kürbis thanked all former and current employees for their indispensable contributions to the company’s success. At the same time, he took a confident look into the future and outlined the company’s goals for the years to come.

Precision in Micro Assembly and SMD Rework

In 1992, Finetech’s start was quite humble: the first systems were built in a rental apartment in Berlin and presented at trade shows. Still, this is where the FINEPLACER® success story started to unfold.

In the Micro Assembly field during the early 1990s, many applications such as MEMS, optoelectronics and flip-chip assembly already required a placement accuracy of 5 micron or better. With the introduction of the FINEPLACER®, the market gladly welcomed this new generation of assembly systems that not only had the technical prowess but were also versatile, affordable and easy to operate. These platforms were particularly attractive for financially strapped start-ups who suddenly had new opportunities to develop their product ideas and quickly convert them into prototypes. In 1996, Finetech introduced its legendary FINEPLACER® lambda – a die bonder achieving a placement accuracy better than 1 micron.

During this time in electronic manufacturing, new market trends resulted in increasingly complex and ever smaller designs being packaged on densely populated printed circuit boards. In order to ensure safe handling of SMD components, a better placement accuracy and solder processing temperature management were necessary. These requirements were further exacerbated by the nearly-complete ban of leaded solder at the beginning of the new millennium. With specific configurations for soldering of electronic components, FINEPLACER® systems proved to be highly capable. To this day, OEM and EMS service providers worldwide rely on SMD rework systems from Finetech.

In Close Partnership with the Customer

For more than 25 years, FINEPLACER® systems have been representing highest precision and technology flexibility. From laser applications and sensor assembly to nano- and biotech, FINEPLACER® systems are being used for fast and production-related prototype development. Regardless of the environment, Finetech has always worked in partnership with its customers. Many of them have grown in parallel with Finetech, forming countless productive relationships over the years of cooperation.

With 25 years of technological know-how, extensive feasibility tests are carried out for customers in order to develop tailor-made machine configurations. This way, the customer can be sure to always get the best solution for their specific challenge.

With subsidiaries on three continents and an extensive network of representatives around the world, Finetech ensures quick response times, fast on-site service and personal consultation at all times.

From the Innovative Idea to Production

Facilitating innovation and boosting new semiconductor product development have always been driving forces of Finetech. In order to support the customer at the development stage, and also help them transition their processes into production, Finetech has been stepping up efforts to expand its portfolio of automated bonders. Along with its development machines, today the company is offering semi- and fully automated production systems combining process flexibility, high precision and speed.

With such an extensive product range, due to be expanded further in the coming months, Finetech is the only manufacturer in the market who accompanies customers from product development into series production. Finetech customers can expect a lot more in this area – and we look forward to welcoming you at the upcoming Productronica 2017.

The entire Finetech Team would like to thank everyone for their generosity and warm wishes on our anniversary. Your trust in us is our motivation to continue to advance and innovate in collaboration with our customers during the next 25 years.

news-3 Fri, 07 Jul 2017 15:35:00 +0200 Universal Instruments Installs Finetech Multipurpose Bonder in its Advanced Process Laboratory Finetech and Universal Instruments announce the addition of a FINEPLACER® pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal Advanced Process Laboratory (APL) in Conklin, New York, offers comprehensive electronic assembly process research, advanced assembly services and supporting material analyses.  It enables OEMs and contract manufacturers to realize rapid product introduction, maximize yield and optimize reliability.  The APL has long played an influential role in the electronics community, partnering with industry leaders, engaging academia and executing consortium research to develop new and emerging assembly technologies.   It services a wide variety of corporate clients representing many electronics industry sectors.  The versatile Pico bonder is a great fit for the breadth of the APL mission, providing a broad range of electronics bonding technologies: thermocompression, thermosonic and ultrasonic bonding, soldering (AuSn, eutectic SnPb, Indium, C4), adhesive technologies, UV curing and mechanical assembly.

“Our research staff has been anxiously awaiting the installation of our new Finetech pico bonder; they‘ve been queuing up critical experiments for months now,“ remarked Jim Wilcox, manager of the APL AREA Research Consortium.  “The versatility of this bonding system is perfect for the range of packaging assembly challenges we tackle routinely.  Our near-term Pico projects include controlled silver sintering for attachment of power devices, low temperature joining for flexible hybrid electronics and precision thermopression bonding of fine pitch, large die, copper pillar interconnects.  We put it to work on that very first day. “

The FINEPLACER® pico is a versatile platform used in a wide range of micro assembly applications – such as high accuracy die attach and assembly of components that require a novel bonding approach.  It provides a placement accuracy of 5 µm, fast, easy process development, and supports bonding forces up to 700 N.

About Universal Instruments APL

Universal Instruments provides extensive assembly manufacturing process expertise through its Advanced Process Laboratory.  For well over two decades, the APL has hosted the Advanced Research in Electronics Assembly (AREA) Consortium, an industry supported group developing fundamental and mechanistic understanding of materials and processes used in electronics assembly.  The AREA Consortium routinely addresses pertinent and timely industry questions on new assembly technologies and conducts analytical and experimental research to generate applicable knowledge for assembly design and manufacturing process.

news-4 Wed, 08 Feb 2017 15:35:00 +0100 Discover Finetech in French We have expanded our web service for you. From now on, French speaking customers can learn more about the Finetech Micro Assembly division in their native language. Find an overview of our manual to automatic die bonder systems for R&D, prototyping and production as well as in-depth information on applications and technologies.

Visit us today:

news-88 Tue, 24 Jan 2017 15:41:00 +0100 Finetech to Present Development Equipment for Optical Sub-Assemblies at Semicon Korea 2017 Finetech from Berlin is a long-term technology partner for high-precision die packaging and advanced optoelectronics assembly. Over the course of 25 years, Finetech has evolved into a globally leading equipment manufacturer for R&D, prototyping and production needs. One particularly demanding optoelectronic application is the assembly of modern communications modules. Finetech is serving customers from around the world who engage in the development and manufacturing of optical transceiver modules (TOSA/ROSA) with bandwidths from 25 G to 100 G. Even with 25 G modules, the maximum placement error is only ±5 µm in x and y and ±1 µm in z. The maximum angular error θ must not exceed ± 0.5°. All these specifications must be met post-bond.

Assembling optical transceiver modules is a multi-step process which presents a number of challenges. The laser diode arrays must be aligned to the PD array with highest (post-bond) accuracy. Optical active surfaces are touch-free zones, therefore specialized glass mask tooling is required to handle the component. There is the need to work in different focal planes. And finally you need to be able to use different bonding technologies like gluing, fluxless soldering or thermocompression with variable process parameters to be able to build the entire optical transceiver module on the same machine.

Opto-Bonder FINEPLACER® lambda Supports Complete TOSA/ROSA Assembly Process

With the high-precision Opto-Bonder® FINEPLACER® lambda, the company offers a sub-micron die bonder perfectly suited for the complete high-precision assembly of opto-electronic sub-modules.
The system comes with outstanding optical resolution. Customers can opt for a Vision Alignment System which provides a resolution of 0.7 µm. This presents new opportunities when working with ultra small components of 100 µm and less. The ability to see smallest structures renders the FINEPLACER® lambda an ideal fit for precision die attach and advanced packaging in photonics and opto-electronic applications. Available in manual or motorized configurations, the device is the premier choice when maximum technological versatility and fast process implementation is crucial. Typical fields of application include R&D, universities, prototyping and low-volume production.

The FINEPLACER® lambda is capable of handling component sizes from 0.07 x 0.07 mm² to 60 x 90 mm² on a working area up to 190 mm x 52 mm. Wafer sizes up to 6'' are supported. A wide range of applications can be handled, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode array bonding (gluing, curing), the assembly of lenses, mirrors or filters, and the multi-stage assembly of micro-opto-electro-mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.

Finetech to present at Semicon Korea 2017

Visit Finetech to learn more about the latest micro assembly equipment solutions at Semicon Korea 2017, February 8-10, COEX, Seoul, booth #5914 (with GANA Co., Ltd.)

news-46 Sun, 04 Dec 2016 11:37:00 +0100 Innovative Solutions for Precision Die Bonder FINEPLACER® lambda With the acclaimed sub-micron die bonder FINEPLACER® lambda, German equipment manufacturer Finetech offers one of the most compelling high-precision die packaging systems for flexible process and product development. A number of innovative solutions continue to make it a first choice when working with very small semiconductor and optical components. Over the course of almost 25 years, Berlin based equipment manufacturer Finetech has evolved into one of the globally leading system providers for advanced die packaging and micro assembly. Their FINEPLACER® product family includes manual to fully automated die bonder systems for R&D and production.

Number one choice for process development with high placement requirements is the sub-micron die bonder FINEPLACER® lambda. The machine was designed with particular attention to the requirements of a laboratory environment. This includes a high degree of configurability for flexible integration of packaging technologies as well as fast process setup times and instant operation. The developed processes are fully compatible and can be applied later to automated Finetech production equipment.

In its latest iteration, the FINEPLACER® lambda comes with a number of innovations particularly addressing the challenges of working with ultra-small components.

Solutions to see smallest components

One of the core capabilities the FINEPLACER® lambda’s excellent reputation is built on is the superior optical resolution. A combination of USB HD cameras and high quality zoom optics make for a very capable Vision Alignment System. For even more flexibility, various zoom optics can be easily interchanged in order to configure the available field of view. The smallest field of view achieves 0.7 µm resolution, giving users a more detailed picture when working with ultra-small components.

In order to overcome the constraints of small but ultrahigh resolution fields of view, the alignment camera also allows image shifting in order to expand the visible image of a chip in x- and y-direction. This is useful when chip and substrate need to be aligned under maximum magnification and the chip’s fiducials exceed the field of view.

Additional visual information is also gained by the clever illumination concept which combines co-axial illumination and diffuse illumination. The co-axial illumination can be separately adjusted for chip and substrate, allowing for a perfect adaptation to specific conditions, i.e. the degree of surface reflections. The diffuse illumination provides additional image information, i.e. during alignment of components with bumpy structures and surfaces. Similar to the co-axial illumination, the light channels for chip and substrates can be individually adjusted to align structures and fiducials via overlay image.

For every working step, the optimal light values can be stored within the bonding software. When changing the bonding profile, the light settings are immediately available. Especially when working on applications with numerous sub-processes, such as assembly of complex hybrid systems, this solution results in a significantly improved workflow as manual light adjustment is no longer required.

Solutions to handling smallest components

Besides good vision, reliable manual alignment in the sub-micron range depends on precision engineering. Therefore, Finetech has developed a high planarity granite base plate. It enables a low-friction movement and rotation of the FINEPLACER® positioning table.  

The positioning table itself now has an option with optimized Z-travel guide. It is recommended for special applications that require a Z-shift of the substrate from focal plane to the placement plane after alignment. Digital micrometer screws provide 1 µm resolution for all axes.

For applications demanding highest accuracy, a new 50x50 mm² substrate heating option is available. Designed with water-cooled frame and special materials, it reliably keeps lateral drift of the substrate during temperature cycles in the sub-micron range, further adding to outstanding post-bond accuracy. 30 K/s fast heating allows for quick heating processes up to 450°C.

A new 45° dispenser support option for 3 cc and 5 cc cartridges allows dot dispensing of viscous media like adhesive, epoxy or solder between aligned components without compromising the alignment result. Tip lengths up to 1 inch are supported. The dispenser support supports touchdown and touchless modes and can accommodate all standard time-pressure dispensers.

A lot of innovation has gone into the chip handling at the placement arm. The vacuum based chip detection at the tool which is needed to trigger motorized placement and bonding processes now has an improved measuring method. Even particularly small, light and delicate chips can be detected in a very reliable way. In conjunction with adapted tooling, this enables secure handling of components as small as 100 x 100 µm² and below. An additional air purge option for the safe release of smallest components is available.

FINEPLACER® lambda – big ideas for smallest components

The ability to see fine structures and handle smallest components make the FINEPLACER® lambda an ideal fit for precision flip chip bonding, die attach and advanced packaging. This includes demanding applications like VCSEL / Photo Diode assembly, laser soldering, optical components packaging, multi-chip packaging, sensor assembly, or MEMS / MOEMS packaging.

Available in manual or motorized configurations, the device is the premier choice when maximum technological versatility and fast process implementation is required. Typical fields of application include R&D, universities, prototyping and low-volume production.

The system is capable of handling component sizes from 100 x 100 µm² to 15x15 mm² on a working area up to 190 mm x 52 mm. Wafer sizes up to 4" are supported. The FINEPLACER® lambda supports bond forces up to 400 N.

news-89 Thu, 22 Sep 2016 15:46:00 +0200 Finetech and ITRI Co-operate to Promote New Developments in µLED Display Technologies Taiwanese Industrial Technology Research Institute (ITRI) is a world-wide leading facility for research, testing and commercialization of New Technologies. One of the hot topics they're currently working on in the field of information and communication technology is an advanced display technology based on µLED components. For the purpose of refining transfer and assembly processes which allow the economic production of µLED based displays for the consumer market, ITRI and Finetech have recently agreed on an 18 month co-operation project. During this period, Finetech provides free of charge a semi-automated micro assembly platform FINEPLACER® sigma specifically equipped and configured for µLED array assembly.

The core feature is the new, powerful Vision Alignment System FPXvisionTM designed for a high-resolution representation of smallest structures across large object fields. As a first in a manual micro assembly system, FPXvisionTM comes with pattern recognition enabling a unique alignment verification to the operator. In this way, components can be reproducibly aligned as precise as 0.1 µm.

Additionally, the FINEPLACER® sigma is equipped with high-speed top and bottom heating and specifically adapted self-balancing pick and place tools. A Formic Acid Module provides the process gas required to reduce oxide layers and optimize the bonding results.

In return, Finetech as an equipment manufacturer will be involved at an early stage and has a great opportunity to gather first-hand information on display manufacturing processes of tomorrow. The valuable insights in this exciting new technology will be used to further optimize the FINEPLACER® sigma and other FINEPLACER® systems, enabling adaptations and new equipment solutions beneficial for all Finetech customers.

Also, the FINEPLACER® sigma, which is located on the ITRI research campus, will be used as an easy-to-reach demo machine for Taiwanese Finetech customers.

µLED – Exciting New Display Technology Comes with Challenges

µLED based displays are energy-saving and enable particularly high resolution on small areas. Using µLED components is a promising technology when it comes to improving display solutions for smartwatches, smartphones and other mobile devices.

Single µLED components can be as small as 15-30 µm and often have sophisticated structures or shapes. And not only are the components tiny and fragile, additional challenges are presented with very thin Die Attach Foils (DAF) or solder preforms used to connect the assemblies. Once the number of µLED in a product surpasses a critical amount, economic considerations require that the components are handled simultaneously in the form of µLED arrays instead of placing and bonding them one after the other. Also, this allows using µLED with even smaller dimensions which could no longer be handled safely as single components. Depending on the intended resolution, a square inch of the display can be populated by several thousand µLED components.

During the transfer of the µLED array, it is mandatory to ensure co-planarity across the entire array. In order for the display to function properly, all contacts of all µLED components (≤ 5 µm) have to be precisely aligned and bonded onto the substrate with a defined force.

Finetech has longtime experience in the development of high-precision placement and bonding systems used to assemble single µLEDs in a reproducible way. With the FINEPLACER® sigma and the fully-automated FINEPLACER® femto 2, Finetech has extended its portfolio of sub-micron bonders which allow transferring this know-how to innovative solutions for the handling and assembly of arrayed µLED components in process development, prototyping, and production.

news-91 Wed, 14 Sep 2016 15:59:00 +0200 Interview with Finetech Head of Sales Europe, Mr. Thomas Müller, in Nanoindustry Magazine In his interview with Nanoindustry, Thomas Müller talks about the peculiarities of the Russian market and provides an outlook into the current and upcoming Finetech company activities in the region. Finetech is a machine manufacturer from Berlin, Germany. For over 20 years, it has been developing and manufacturing equipment – the FINEPLACER® systems – for the semiconductor industry. One business segment is building machines for the professional rework of printed circuit boards in production environments. With hot-gas SMD rework stations, the company is a technology partner of renowned and worldwide leaders like Microsoft, Siemens, and many more. The second mainstay is the development and manufacturing of micro assembly systems. Customers from all over the world rely on flexible and highly precise die bonders – with typical fields of applications being R&D, prototyping or small series production.

Mr. Müller, how do you estimate the position of the company in the main sectors of the micro assembly market?

We’re continuously working on developing our products further to offer high-tech products "Made in Germany". We consider ourselves a leading manufacturer of R&D bonders for optoelectronics, chip packaging, detector assembly and many more demanding applications. Strong points of our products include high placement accuracy, unrivaled technological flexibility, but also reliability and an easy-to-use operating concept.

A sub-micron die bonder like the manual FINEPLACER® lambda can be easily used for high precision soldering of a laser bar with e.g. AuSn. Due to a wide range of compatible extension modules and tools the same machine can also be used for ultrasonic or thermocompression bonding or for adhesive technologies. This degree of flexibility is highly appreciated by universities, institutes or commercial R&D departments.

With two recent entries in the 0.5 μm class, FINEPLACER® sigma and FINEPLACER® femto 2, we push forward to offer solutions for the semi and fully automated semiconductor production.

What are competitive advantages of the company?

Against the general trend, we have decided years ago to keep the entire product development and production chain in our hands. This includes the machine hardware, process modules, control electronics, tooling, software, and more. Today, this proves to be a real advantage, especially when working on customer-specific solutions. The in-house approach results in short ways and response times during development and manufacturing.

We also put special emphasis on our application support unit. Experienced engineers help our customers with process development and sample assemblies. The close partnership gives us insights in the latest developments in microelectronics, photonics or medical technologies. Valuable information which directly informs the development of new FINEPLACER® systems.

And wherever in the world we have machine installations, high quality service is our top priority. Our very own service engineers as well as the ones from our partners are constantly being trained in order to meet the high requirements of our customers. [...]

news-90 Wed, 14 Sep 2016 15:56:00 +0200 Finetech Participates in SPEED Project Funded by the Federal Ministry of Education & Research As part of the co-operative project "Silicon Photonics Enabling Exascale Data Networks (SPEED)", Finetech handles the experimental assembly of innovative silicon photonics based 4-wavelenghts- 400 GB/s-transceivers with direct detection. Digital information is an essential part of our life. The exponentially growing amount of transmitted data is a key challenge in the development of future-proof data networks. Society's demand to provide more bandwidth for all subscribers is accounted for by developing increasingly powerful network components.

In light of these requirements, the Federal Ministry of Education & Research is funding the project „Silicon Photonics Enabling Exascale Data Networks (SPEED)". Bringing together numerous German research institutes and component manufacturers, main goal is the development of high-bit-rate optical transceiver modules as an essential part of future waveguide based networks. The board-mount optical transmitter and receiver modules allow highest transmission rates for data transfer between data centers.

Key objective is the development of two 400 Gb/s transceiver module for various areas of application. One is a four wavelength direct-detect solution for intra-data center, while the other is a single-wavelength tunable coherent device for inter-data center interconnects.

Both modules will be designed based on innovative silicon photonics. This forward-looking technology is already playing a big part in modern communications electronics and is increasingly common on the market.

The innovative approach pursued by the SPEED consortium will help the industry tackle critical issues concerning cost efficiency, power consumption and thermal management. Moreover, the project is to lay the foundations of an entire value chain for innovative transceiver modules made in Germany.

FINEPLACER® Bonders to Handle Challenging Assembly Tasks

A major challenge in building the modules is engineering an assembly process to adjust the laser at a defined angle. To this date, this could only be realized with complex calculations leading to a fixed machine configuration provided by the system manufacturer. The alternative was a fully-automatic flip chip bonder. However, especially for small and medium-sized companies, investing in an advanced fully-automated bonding system is a big financial commitment and a  venture that is often difficult to assess. Therefore, an explicit sub goal of SPEED is to realize assembly solutions specifically suited for laboratory bonders to make it easier for start-up and smaller companies to enter this new market segment.

With long-term experience in manufacturing manual and semi-automated R&D bonders and a profound knowledge of how to develop new applications and technologies, Finetech is a natural partner of the SPEED consortium.

The semi-automated customizable die bonders support a variety of sub-micron assembly technologies and provide optimal conditions for the assembly of experimental demonstrator samples of the innovative transceiver modules.

The patented FINEPLACER® alignment and placement principle suits the assembly of a wide spectrum of components and submodules from various industries, such as medical technology, precision mechanics, sensor assembly, solar technology for high power lasers, mini displays or nano technology.

The FINEPLACER® bonder's modular system architecture supports the future-proof retrofit of new technologies and flexible machine configurations adaptive to changing requirements.

news-92 Mon, 14 Mar 2016 16:05:00 +0100 Record attendance at Micro Assembly Day 2016 On March 10, we have held the International Micro Assembly Day, a one-day conference dedicated to advanced packaging and micro assembly. A record number of more than 65 visitors from all over Europe took the opportunity to connect and actively share knowledge of a wide range of the latest technological trends and concepts. Notable speakers from industry and science brought their expertise with insights in current market applications.

The Micro Assembly Day traditionally covers a broad spectrum of topics. Some of the subjects tackled this year included bonding technologies for 3D Packaging, packaging for opto- and microelectronics, nanowire based IC and packaging, hybrid MEMS assembly for biomedical applications, micro-sized LED displays, laser assisted die bonding, precision vacuum die bonding, ACF bonding and sintering strategies with silver particle paste and foil.

Additionally, all visitors got a chance to join guided tours around our new production and development center with a unique first-hand experience of the FINEPLACER® manufacturing facilities, application labs and tool production. As not all the questions could be covered in detail, many customers returned on Friday for individual machine hands-on and consultation sessions with Finetech application specialists and product managers.

We'd like to thank all participants and speakers for coming to Berlin and contributing to the event’s success. Hope to welcome you soon at further Finetech events!