Hot Air SMD Rework Station FINEPLACER core plus
FINEPLACER® coreplus
The All-Round Solution

Hot Air SMD Rework Station

The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies.

The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).

The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).

A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.

"In addition to the technical possibilities, it is a real advantage for us that we can exchange soldering tools, already qualified soldering programs and processes between our FINEPLACER® systems. In addition, Finetech offers a fast, reliable and fair service and the experience with our previous FINEPLACER® system was nothing but positive.”

Moritz Lanio
Head of Technology Department, Mair Elektronik

Live Online Demo

Fill out the form to register for an online machine demo or make an appointment for a machine hands-on at one of our locations.

You want to save time and money? You don't want postponed trade shows or international travel restrictions to hamper your investment decision?

A live online product demonstration is a great and convenient way of experiencing our range of high-precision micro assembly and advanced rework solutions from the comfort of your working desk.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Key Facts*

  • Whole rework cycle in one cost-effective system
  • Compact and robust machine design
  • High efficiency board heater*
  • Advanced rework capabilities
  • JEDEC/IPC conform processes
  • Live process monitoring*
  • Intuitive user experience
  • Process traceability
  • Semi-automated processes

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Bar Code Reader "SmartIdent"

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Direct Component Printing Module

Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.

Dispense Module

Integration of dispensing systems for applying flux, solder paste, adhesive or other pasty material. Various supported types like time-pressure or volume dispensers.

Hot Gas Bottom Heating Module

Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Overlay vision alignment system (VAS)

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

PCB Support

Customized clamping solution for various shapes of PCBs.

Process Gas Switching Module

For an economic use of nitrogen as hot gas, to save resources, energy and money.

Process Start Sensor

Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.

Process Video Module

Allows the in-situ observation of the working area during the soldering process.

Reballing Module

Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

Solder Removal Module

Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

Split Field Optics

Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

Top Heating Module (Hot Gas)

Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.

Touch Screen "Smart Control"

Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.

Tray Support

Allows presentation of components from GelPak®, VR trays, waffle packs or tape holders as well as the support of dipping trays or cleaning units.

Zoom Optics

Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.

Videos

BGA Rework

Desoldering, soldering, residual solder removal on flat panel TV PCB.

BGA Reballing

This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.

Rework of GPU

Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.