Advanced Sub-Micron Bonder
The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.
A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, the system stands for highly stable assembly processes with the focus on maximum yield.
The new generation of the femto platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.
Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.
"The FINEPLACER® femto 2 has enabled our company to realize higher throughput automation of our high accuracy flip chip bonding operations. As our high reliability opto-electronic transceiver business is expanding, this has helped us to satisfy our customer’s growing needs."Howard Lenos
Ultra Communications, Inc.
- Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
- Wide range of controlled bonding forces
- Multi-chip capability
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Safe and controlled process environment with cleanroom quality
- UHD vision alignment system with FPXvisionTM
- Modular machine platform allows in-field retrofitting during entire service life
- Ultra low bonding force
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Large bonding area
- Various bonding technologies in one recipe
- Wide range of supported component sizes
- In-situ process observation in HD
- 3-color LED illumination
- Data/media logging and reporting function
- Full process access & easy visual programming with touch screen interface
- Synchronized control of all process related parameters
- Process and material traceability via TCP (for MES)
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Integrated scrubbing function
- Fully automatic and manual operation
- Automatic tool management
Applications & Technologies
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Use different tools or tool tips, automatic exchange in process.
Enhances the existing bond force range and allows the use of software controlled process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Pick up components directly from blue tape.
Used to flip components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Innovative digital beam splitter with two HD cameras provides highest optical resolution across a large field of view.
Used to handle and rotate substrates up to 360° independently from the bonding tool.
Allows automatic focus setting of component and substrate as well as height measurements.
Allows sensing of heights by means of Laser triangulation for measuring purposes.
Allows ultra-fast heat cycles du to an integrated high power laser source
Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Description coming soon.
Allows the in-situ observation of the working area during the bonding process.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet light in various wave length for adhesive processes without thermal influence.
Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder
The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.
FINEPLACER® femto 2 - Tacking, Bump Bonding
Population of a sensor substrate with several readout chips. Integrated oven process for preparation (bump forming with formic acid) and connection of the fine-pitch bump arrays via tack bonding (indium). Followed by a global reflow process in inert atmosphere.
Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are ...