Hot Air SMD Rework Station
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a bestseller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.
Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
"We have been partners with Finetech for over 15 years now and they have always been open to our needs. The support they provide is immeasurable – their engineering team is very accessible and everyone is well connected and deeply involved with each project. The quality we get is always at the highest level – from the first to the 2,000th board.”
Nafi Pajaziti
CEO, BMK Electronic Services
Key Facts*
- Full hot air rework system
- One system for rework and micro assembly
- Industry-leading thermal management
- Unique FINEPLACER® working principle
- Placement accuracy better 5 µm
- In-situ process observation in HD
- Data/media logging and reporting function
- Overlay vision alignment system (VAS) with fixed beam splitter
- 3-color LED illumination
- Full process access and easy programming
- Synchronized control of all process related parameters
- Software controlled top heater calibration
- Modular machine platform allows in-field retrofitting during entire service life
- Individual configurations with process modules
- Fully manual or semi-automatic machine versions
- Force controlled component handling
Applications & Processes
From small 008004 components to massive BGA - with a broad range of supported applications and processes, our professional SMD rework systems are ready to tackle any SMD rework challenge. With industry-leading thermal management and a modular hardware and software architecture, our SMD rework systems have been designed to yield reproducible process results for all steps of the SMD rework cycle.
Functions - Modules - Enhancements
Our SMD rework solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional SMD rework processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the SMD rework system easier and help to make certain process sequences even more efficient.
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.
Integration of dispensing systems for applying flux, solder paste, adhesive or other pasty material. Various supported types like time-pressure or volume dispensers.
Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Precise visual alignment of chip and substrate.
Customized clamping solution for various shapes of PCBs.
For an economic use of nitrogen as hot gas, to save resources, energy and money.
Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.
Allows the in-situ observation of the working area during the bonding process.
Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Description coming soon
Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.
Technical Paper
Rework of 01005 and 008004 Small Passives
008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules,...
