Hot Air SMD Rework Station FINEPLACER pico rs
FINEPLACER® pico rs
Precision and Flexibility for Advanced Rework

Hot Air SMD Rework Station

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.

The system is a bestseller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

"We have been partners with Finetech for over 15 years now and they have always been open to our needs. The support they provide is immeasurable – their engineering team is very accessible and everyone is well connected and deeply involved with each project. The quality we get is always at the highest level – from the first to the 2,000th board.”

Nafi Pajaziti
CEO, BMK Electronic Services
Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

Key Facts*

  • Full hot air rework system
  • One system for rework and micro assembly
  • Industry-leading thermal management
  • Unique FINEPLACER® working principle
  • Placement accuracy better 5 µm
  • In-situ process observation in HD
  • Data/media logging and reporting function
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • 3-color LED illumination
  • Full process access and easy programming
  • Synchronized control of all process related parameters
  • Software controlled top heater calibration
  • Modular machine platform allows in-field retrofitting during entire service life
  • Individual configurations with process modules
  • Fully manual or semi-automatic machine versions
  • Force controlled component handling

Applications & Processes

From small 008004 components to massive BGA - with a broad range of supported applications and processes, our professional SMD rework systems are ready to tackle any SMD rework challenge. With industry-leading thermal management and a modular hardware and software architecture, our SMD rework systems have been designed to yield reproducible process results for all steps of the SMD rework cycle.

Functions - Modules - Enhancements

Our SMD rework solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional SMD rework processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the SMD rework system easier and help to make certain process sequences even more efficient.

Bar Code Reader "SmartIdent"

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Manual Dipping Unit

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

Overlay vision alignment system (VAS) with fixed beam splitter

Precise visual alignment of chip and substrate.

RGW-Illumination

Description coming soon

Split Field Optics

For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration.  Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Traceability Module

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Videos

01005 Small Passives Rework

Process camera video: desoldering of 01005 small passive with small gap.

QFN desoldering

Process camera video: removing a QFN component.

PoP Rework

Process camera video: Active clamping soldering head for rework of PoP stacked components.

Your Sales Contact Robert Avila

Finetech USA/West Coast
+1 480 893-1630
Send an email

A free user account is needed

With a user account you can download:

  • product flyers
  • technical data sheets (after activation)
  • technical papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.