Sub-Micron Bonder
The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging.
It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.
The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
"The FINEPLACER® lambda system is versatile enough to support multiple applications or designs and still support micro-alignment accuracies. The variety of modules along with their “easy-to-switch / easy-to-use” procedures is a key enabler for a multi project development platform."
Avi Maman
DustPhotonics, Inc.
Key Facts*
- Sub-micron placement accuracy
- Superior optical resolution
- Fully manual or semi-automatic machine versions
- Full process access and easy programming
- Individual configurations with process modules
- Excellent price performance ratio
- In-situ process observation in HD
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Modular machine platform allows in-field retrofitting during entire service life
- Synchronized control of all process related parameters
- Overlay vision alignment system (VAS) with fixed beam splitter
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- Full process access & easy visual programming with touch screen interface
- 3-color LED illumination
- Sequence control with predefined parameters
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any photonics application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of photonic applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Enhances the existing bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Allows extending the field of view in Y-direction.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Used to flip components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Designed to bond components with a defined distance to the substrate.
Allows the exchange of the achromatic lens to work with different fields of view and optical resolutions.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Allows rotating the tool (and component) at the placement arm to correct angular errors.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.
Technical Paper
VCSEL Bonding
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...
