Advanced Sub Micron Assembly Platform
The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N.
The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.
Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.
The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.
- Sub micron placement accuracy
- Large working area
- High bonding forces
- Software controlled alignment due to pattern recognition
- Full process access and quick process setup
- FPXvisionTM: maximum resolution across large field of view
"We use the FINEPLACER® sigma for a variety of applications, ranging from simple chip-to-submount to complex module assemblies with very high accuracy requirements. Easy manual operation makes the system also an ideal fit for low-quantity research samples."Lars Schellhase
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Enhances the existing Bond force range and allows the use of software controlled process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Used to pick up components directly from blue tape.
Used to flip components prior to face-down assembly.
Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.
Motorized feed unit to move dispenser into working or parking position.
Various types of dispensing systems to apply flux, solder paste, adhesive or other material.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Innovative digital beam splitter with two HD cameras provides highest optical resolution across a large field of view.
Designed to bond components with a defined distance to the substrate.
Allows automatic focus setting of component and substrate as well as height measurements.
Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.
Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet light in various wave length for adhesive processes without thermal influence.
Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.