Clean room production - automatic die bonder
Accuracy meets automation

Easy process transition from concept and development to production.
For your ideas in series.

Finetech die bonders for fully-automated semiconductor production combine optimized throughput with high placement accuracy and unrivaled process flexibility.

Due to their modular platform design, automated systems by Finetech can be easily adjusted to the ever-changing technological trends, becoming a future-proof investment and a perfectly fitting solution for your production needs.

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