FineXT 5205
The Ideal Solution for Customized Production

Multi-Purpose Bonder

The FineXT 5205 is a fully automated micro assembly platform with multi-technology capability for prototyping and manufacturing.

The modular architecture with interchangeable process modules supports a diverse range of applications. A freely configurable multi-head interface for up to five working heads enables free combinations of different bonding technologies in one assembly procedure.

Enhanced with automatic material handling and tool management as well as advanced handling of 3D substrates / MID, this ensures highest flexibility to meet specific process requirements of today and tomorrow. The FineXT 5205 is your pathway to assembling very complex and technically advanced products in larger numbers.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Key Facts*

  • Up to 5 freely configurable slots for various technology heads
  • 3D assembly / MID capability with active alignment
  • Wide range of supported component sizes
  • Large bonding area
  • 3D camera system
  • Modular machine platform allows in-field retrofitting during entire service life
  • Various bonding technologies in one recipe
  • Wide range of component presentation incl. tray/ tape feeder
  • In-line capability with automatic substrate transport system
  • In-field configurable working area
  • Safe and controlled process environment with cleanroom quality
  • Adjustable Speed for Production
  • Dual-camera system for alignment
  • Process module compatibility across Finetech platforms
  • Individual configurations with process modules
  • Data/media logging and reporting function
  • Placement accuracy 5 µm
  • Multi wafer capability
  • Fully automatic material management
  • Automatic tool management
  • Multi-chip capability
  • Process and material traceability via TCP (MES, SMEMA)
  • Synchronized control of all process related parameters
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • 3-color LED illumination

Applications & Technologies

IGBT assemblyAcceleration sensor assemblyRFID module assemblyGeneric MOEMS assemblyUltrasonic receiver assemblyHigh-power laser module assemblyNFC device packagingRF / HF module assemblyGeneric MEMS assemblyGas pressure sensor assemblyMechanical assemblyVisual image sensor assembly
Flex on BoardFlip chip bonding (face down)Multi chip packaging (MCM, MCP)2.5D and 3D IC packaging (stacking)Precision die bonding (face up)Chip on Glass (CoG)3D-MID bondingChip on Flex/Film (CoF)Chip on Board (CoB)

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Automatic Tool Changer

Use different tools or tool tips, automatic exchange in process.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Die Flip Module

Used to flip components prior to face-down assembly.

Dipping/Stamping Module

Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Flip Chip Test Module

The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Height Scanner (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Height Scanner (Laser)

Allows sensing of heights by means of Laser triangulation for measuring purposes.

ID Code Reader

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.


For automatic transport of substrates. Width-adjustable for various substrate dimensions.

Laser Heating Module

Allows ultra-fast heat cycles du to an integrated high power laser source

Laser Ignition Module

Description coming soon.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Tray & Tape Feeder

Description coming soon.

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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