The FineXT 5205 is a fully automated micro assembly platform with multi-technology capability for prototyping and manufacturing.
The modular architecture with interchangeable process modules supports a diverse range of applications. A freely configurable multi-head interface for up to five working heads enables free combinations of different bonding technologies in one assembly procedure.
Enhanced with automatic material handling and tool management as well as advanced handling of 3D substrates / MID, this ensures highest flexibility to meet specific process requirements of today and tomorrow. The FineXT 5205 is your pathway to assembling very complex and technically advanced products in larger numbers.
- Up to 5 freely configurable slots for various technology heads
- 3D assembly / MID capability with active alignment
- Various bonding technologies in one recipe
- Wide range of supported component sizes
- 3D camera system
- Modular machine platform allows in-field retrofitting during entire service life
- In-line capability with automatic substrate transport system
- Wide range of component presentation incl. tray/ tape feeder
- Large bonding area
- In-field configurable working area
- Placement accuracy 5 µm
- Multi-chip capability
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Safe and controlled process environment with cleanroom quality
- Multi wafer capability
- Dual-camera system for alignment
- 3-color LED illumination
- Process and material traceability via TCP (MES, SMEMA)
- Data/media logging and reporting function
- Synchronized control of all process related parameters
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Adjustable speed for production
- Automatic tool management
- Fully automatic material management
Applications & Technologies
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Use different tools or tool tips, automatic exchange in process.
Enhances the existing bond force range and allows the use of software controlled process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Pick up components directly from blue tape.
Used to flip components prior to face-down assembly.
Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Allows sensing of heights by means of Laser triangulation for measuring purposes.
Description coming soon.
Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.
For automatic transport of substrates. Width-adjustable for various substrate dimensions.
Allows ultra-fast heat cycles du to an integrated high power laser source
Description coming soon.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Description coming soon.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet light in various wave length for adhesive processes without thermal influence.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.