Automated Bonding Platform for R&D and Production
FineXT 5205

Automated Flexible Bonding Platform for R&D and Production

The FineXT 5205 is a fully automated micro assembly platform with multi-technology capability for prototyping and manufacturing.

The modular architecture with interchangeable process modules supports a diverse range of applications. A freely configurable multi-head interface for up to five working heads enables free combinations of different bonding technologies in one assembly procedure.

Enhanced with automatic material handling and tool management as well as advanced handling of 3D substrates / MID, this ensures highest flexibility to meet specific process requirements of today and tomorrow. The FineXT 5205 is your pathway to assembling very complex and technically advanced products in larger numbers.

  • Up to 5 freely configurable process heads
  • Multi-chip, multi-placement capability
  • Epoxy and soldering processes in one machine
  • Large working area
  • Wide range of component presentations
  • Up to 3 different epoxies in one pass
  • 3D-MID assembly
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Bonding Force Module (automatic)

Enhances the existing Bond force range and allows the use of software controlled process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Used to pick up components directly from blue tape.

Die Flip Module

Used to flip components prior to face-down assembly.

Dipping/Stamping Module

Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.

 

Dispense Support Module

Motorized feed unit to move dispenser into working or parking position.

Dispense Unit

Various types of dispensing systems to apply flux, solder paste, adhesive or other material.

Flip Chip Test Module

The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.

Handling Module

Used to handle and rotate substrates up to 360° independently from the bonding tool.

Laser-assisted Bonding Module

Allows ultra-fast heat cycles du to an integrated high power laser source

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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