Multi-Purpose Bonder
The FineXT 5205 is a fully automated micro assembly platform with multi-technology capability for prototyping and manufacturing.
The modular architecture with interchangeable process modules supports a diverse range of applications. A freely configurable multi-head interface for up to five working heads enables free combinations of different bonding technologies in one assembly procedure.
Enhanced with automatic material handling and tool management as well as advanced handling of 3D substrates / MID, this ensures highest flexibility to meet specific process requirements of today and tomorrow. The FineXT 5205 is your pathway to assembling very complex and technically advanced products in larger numbers.
Key Facts*
- Up to 5 freely configurable slots for various technology heads
- 3D assembly / MID capability with active alignment
- Wide range of supported component sizes
- Large bonding area
- 3D camera system
- Modular machine platform allows in-field retrofitting during entire service life
- Various bonding technologies in one recipe
- Wide range of component presentation incl. tray/ tape feeder
- In-line capability with automatic substrate transport system
- In-field configurable working area
- Safe and controlled process environment with cleanroom quality
- Adjustable Speed for Production
- Dual-camera system for alignment
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Data/media logging and reporting function
- Placement accuracy 5 µm
- Multi wafer capability
- Fully automatic material management
- Automatic tool management
- Multi-chip capability
- Process and material traceability via TCP (MES, SMEMA)
- Synchronized control of all process related parameters
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- 3-color LED illumination
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.
Use different tools or tool tips, automatic exchange in process.
Enhances the existing bond force range and allows the use of software controlled process forces.
For determining spatial coordinates of objects to be processed using image recognition (RGB lighting).
For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.
Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.
Allows flipping of components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Used to handle and rotate substrates up to 360° independently from the bonding tool.
For determining heights, lengths and coordinates of objects to be processed by image recognition (RGB illumination/coaxial illumination).
Allows sensing of heights by means of Laser triangulation for measuring purposes.
For determining heights, lengths and coordinates of objects to be processed by mechanical path measurement.
Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.
Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.
For automatic loading / unloading of substrates. Width-adjustable for various substrate dimensions.
Activation / ignition of reactive materials such as nanofoils by laser pulse.
Allows ultra-fast heat cycles du to an integrated high power laser source
Lifting objects from conveyor units into a processing position.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Tilting unit with motorized angular adjustment in the axes phi(X) and phi(Y). This nick and roll movement can be used for parallel positioning or for bonding at certain angular positions.
Preparation of assembly surfaces using atmospheric plasma for better wetting during joining processes.
SPC (Statistical Process Control) for dispensing volumes in the automatic process flow.
Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Accommodates 300 mm wafer cassettes. Programmable speed and slots.
Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.
Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Infeed/outfeed of objects for automatic processing in larger quantities on a minimal presentation area.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.
Technical Paper
Eutectic Bonding with Au/Sn
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
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