Automated Sub-micron Die Bonder for Photonics Production
FINEPLACER® femto 2
Unrivaled Flexibility for Prototyping & Production

Advanced Sub-Micron Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.

A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, the system stands for highly stable assembly processes with the focus on maximum yield.

The new generation of the femto platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

"The FINEPLACER® femto 2 has enabled our company to realize higher throughput automation of our high accuracy flip chip bonding operations. As our high reliability opto-electronic transceiver business is expanding, this has helped us to satisfy our customer’s growing needs."

Howard Lenos
Ultra Communications, Inc.
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Key Facts*

  • Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates
  • Wide range of controlled bonding forces
  • Multi-chip capability
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Safe and controlled process environment with cleanroom quality
  • UHD vision alignment system with FPXvisionTM
  • Modular machine platform allows in-field retrofitting during entire service life
  • Ultra low bonding force
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Large bonding area
  • Various bonding technologies in one recipe
  • Wide range of supported component sizes
  • In-situ process observation in HD
  • 3-color LED illumination
  • Data/media logging and reporting function
  • Full process access & easy visual programming with touch screen interface
  • Synchronized control of all process related parameters
  • Process and material traceability via TCP (for MES)
  • Process module compatibility across Finetech platforms
  • Individual configurations with process modules
  • Integrated scrubbing function
  • Fully automatic and manual operation
  • Automatic tool management

Applications & Technologies

Generic MEMS assemblyGas pressure sensor assemblyHigh-power laser module assemblyMicro-optical bench assemblyUltrasonic transceiver assemblyIR detector assemblyLaser diode assemblyVisual image sensor assemblyAcceleration sensor assemblyVCSEL/photo diode (array) assemblyX-ray detector assemblyLaser diode bar assemblyGeneric MOEMS assemblySingle photon detector assemblyOptical sub assembly (TOSA/ROSA)Micro optics assemblyLens (array) assemblyInk jet print head assemblyE-beam module assemblyMechanical assembly
Chip on Flex/Film (CoF)Chip on Glass (CoG)Multi chip packaging (MCM, MCP)Flip chip bonding (face down)2.5D and 3D IC packaging (stacking)Wafer level packaging (FOWLP, W2W, C2W)Precision die bonding (face up)Flex on boardChip on board (CoB)

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Automatic Tool Changer

Use different tools or tool tips, automatic exchange in process.

Bonding Force Module

Enhances the existing bond force range and allows the use of software controlled process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Pick up components directly from blue tape.

Die Flip Module

Used to flip components prior to face-down assembly.

Dispense Module

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Flip Chip Test Module

The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

FPXvisionTM

Innovative digital beam splitter with two HD cameras provides highest optical resolution across a large field of view.

Handling Module

Used to handle and rotate substrates up to 360° independently from the bonding tool.

Height Scanner (Autofocus)

Allows automatic focus setting of component and substrate as well as height measurements.

Height Scanner (Laser)

Allows sensing of heights by means of Laser triangulation for measuring purposes.

Laser Heating Module

Allows ultra-fast heat cycles du to an integrated high power laser source

Pattern Recognition

Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Gas Selection

Description coming soon.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Vacuum Chamber Module

Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Videos

FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder

The FINEPLACER® femto 2 bonder offers a precise large working stage, large device 3D handling, extended FOV, ultra HD vision system, and multicolor illumination. System features include a process gas enclosure, low and high bond force, and a local cleanroom environment.

FINEPLACER® femto 2 - Tacking, Bump Bonding

Population of a sensor substrate with several readout chips. Integrated oven process for preparation (bump forming with formic acid) and connection of the fine-pitch bump arrays via tack bonding (indium). Followed by a global reflow process in inert atmosphere.

FINEPLACER® femto 2 - Die Flipping Unit

Integrated die flip module automatically flips chips of various sizes and thickness. Can be used for chips that are presented with the bond side facing upward. Interchangeable platforms of the unit allow for component-specific adaptation.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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