Compact Hot Air Rework Station
The FINEPLACER® coreplus is an all-around hot air rework station for electronic components and assemblies.
The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).
The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).
A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.
"In addition to the technical possibilities, it is a real advantage for us that we can exchange soldering tools, already certified soldering programs and processes between our FINEPLACER® systems. In addition, Finetech offers a fast, reliable and fair service and the experience with our previous FINEPLACER® system was nothing but positive.”Moritz Lanio
Head of Technology Department, Mair Elektronik
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
Designed for local and precise positioned paste applying.
Our approach replaces excessive electrical power application by efficient use of energy to protect board and component.
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Is an “All in One“ solution for reworking QFN, SON and MLF components.
Motorized feed unit to move dispenser into working or parking position.
Various types of dispensing systems (e.g. volume or jet dispenser) to apply solder paste or other material.
Infrared Underheater. 500 W heating power are available to heat up PCB efficienly and precise. Unique features are the very compact design, fast responding and precise heating.
Infrared underheater. 2.000 W heating power are available to heat up heavy PCB efficiently. Uniquie features are the very compact design, the large power density and the fast responding heating source.
HOTPLATE 04 is a flat and and powerful under heater allows efficient work on heavy electrical systems with flat bottom surface and LED PCBs.
The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of component and board.
Dedicated PCB holders for any kind of board.
Measures the temperature of a defined point on the board surface for reproducible process conditions.
Allows the in-situ observation of the working area during the soldering process.
Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Manual extraction of residual solder. As a stand-alone device, it virtually fits on any work bench and can be flexibly operated with two handheld pens.
Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.
Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.
This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.
Rework of BGA/CSP and CPU/GPU SMD
The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.
Precise placement of a new solder ball array is called array reballing. This repair process is applied when saving valuable resources (and money) is crucial or when the value chain has to be extended.