Hot air BGA rework station
FINEPLACER® pico rs

Modular Hot Air SMD Rework Station

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.

The system is a bestseller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

  • Industry-leading thermal management
  • High efficiency board heater
  • Closed loop force control
  • Automated top heater calibration
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

Board Printing Tools

Designed for local and precise positioned paste applying.

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Direct Component Printing Module

Is an “All in One“ solution for reworking QFN, SON and MLF components.

Dispense Support Module

Motorized feed unit to move dispenser into working or parking position.

Dispense Unit

Various types of dispensing systems (e.g. volume or jet dispenser) to apply solder paste or other material.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of component and board.

PCB Support

Dedicated PCB holders for any kind of board.

Process Start Sensor

Measures the temperature of a defined point on the board surface for reproducible process conditions.

Process Video Module

Allows the in-situ observation of the working area during the soldering process.

Reballing Module

Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

Solder Removal Module

Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

 

Split Field Optics

Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

Videos

01005 Small Passives Rework

Process camera video: desoldering of 01005 small passive with small gap.

QFN desoldering

Process camera video: removing a QFN component.

PoP Rework

Process camera video: Active clamping soldering head for rework of PoP stacked components.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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