Modular Hot Air SMD Rework Station
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a bestseller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.
Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
"We have been partners with Finetech for over 15 years now and they have always been open to our needs. The support they provide is immeasurable – their engineering team is very accessible and everyone is well connected and deeply involved with each project. The quality we get is always at the highest level – from the first to the 2,000th board.”Nafi Pajaziti
CEO, BMK Electronic Services
Applications & Processes
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Designed for local and precise positioned paste applying.
Our approach replaces excessive electrical power application by efficient use of energy to protect board and component.
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Is an “All in One“ solution for reworking QFN, SON and MLF components.
Motorized feed unit to move dispenser into working or parking position.
Various types of dispensing systems (e.g. volume or jet dispenser) to apply solder paste or other material.
Infrared Underheater. 500 W heating power are available to heat up PCB efficienly and precise. Unique features are the very compact design, fast responding and precise heating.
Infrared underheater. 2.000 W heating power are available to heat up heavy PCB efficiently. Uniquie features are the very compact design, the large power density and the fast responding heating source.
HOTPLATE 04 is a flat and and powerful under heater allows efficient work on heavy electrical systems with flat bottom surface and LED PCBs.
The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of component and board.
Dedicated PCB holders for any kind of board.
Measures the temperature of a defined point on the board surface for reproducible process conditions.
Allows the in-situ observation of the working area during the soldering process.
Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
Manual extraction of residual solder. As a stand-alone device, it virtually fits on any work bench and can be flexibly operated with two handheld pens.
Allows precise residual solder removal in an inert atmosphere. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
Allow two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.
Rework of 01005 and 008004 Small Passives
008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules,...
Rework of QFN/MLF
Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics (for example resulting in much shorter reaction times) are being increasingly incorporated into...