Multi-Purpose Bonder
The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.
This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.
"The FINEPLACER® pico ma guarantees us maximum flexibility. With its variable bonding force range, we are capable of bonding very small to larger components. All of them can be precisely aligned, which is essential when dealing with small pitch and miniaturized contacts."
Sebastian Quednau
NanoWired GmbH
Key facts
- Excellent cost-performance ratio
- All kinds of chip bonding technologies, including reflow soldering
- Placement accuracybetter 5 µm
- Wide range of supported component sizes
- Full process traceability and protocol function incl. photo and video capturing
- Ready-to-work design and easy-to-use operator interface
- Plug & Play configuration of process modules
Applications & Technologies
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Technical Paper
RFID Assembly
RFID chips (Radio Frequency Identification) are increasingly used in industrial and consumer products. They come in sizes from several millimeters down to a few microns, with very thin and flexible substrates prone to thermal stress.
