Flip Chip Bonder for R&D labs
FINEPLACER® pico ma

Multi-purpose Die Bonder

The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.

This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.

  • Placement accuracy better 5 micron
  • Wide range of supported component sizes
  • Enhanced working area enables wafer applications
  • Technological versatility incl. reflow capability
  • User-independent semi-automatic configurations for 24/7 operations
  • Easy-to-use operator interface
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Functions - Modules - Enhancements

Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.

ACF Module

Used to place non-transparent or transparent ACF with defined force and temperature after chip alignment

Bonding Force Module (automatic)

Enhances the existing Bond force range and allows the use of software controlled process forces.

Bonding Force Module (manual)

Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

Chip Heating Module

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Component Presentation

Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.

Die Eject Module

Used to pick up components directly from blue tape.

Die Flip Module

Used to flip components prior to face-down assembly.

Dispense Support Module

Motorized feed unit to move dispenser into working or parking position.

Dispense Unit

Various types of dispensing systems to apply flux, solder paste, adhesive or other material.

Flip Chip Test Module

The “Known Good Die Testing” allows chip probing/ testing prior to the bonding process.

Formic Acid Module

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Gap Adjustment Module

Designed to bond components with a defined distance to the substrate.

Optical Overlay Alignment VAS

Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.

Optics Shifting

Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

Process Gas Module

Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.

Process Video Module

Allows the in-situ observation of the working area during the bonding process.

Scrubbing Module

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Substrate Heating Module

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding

Substrate Support

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Target Finder

Enables coarse position alignment of the table to the tool with the help of a laser spot.

Traceability Module

Automatic recognition of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Ultrasonic Module

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

UV Curing Module

Provides ultra violet light in various wave length for adhesive processes without thermal influence.

Wafer Heating Module

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

Zoom Optics

Allows the adaptation of the Alignment System’s field of view to ensure an optimized visual presentation of components and substrates.

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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