Flexible Sub-micron Die Bonder
The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging.
It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.
The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
"The FINEPLACER® lambda system is versatile enough to support multiple applications or designs and still support micro-alignment accuracies. The variety of modules along with their “easy-to-switch / easy-to-use” procedures is a key enabler for a multi project developent platform."Avi Maman
- Sub-micron placement accuracy
- All kinds of chip bonding technologies (adhesive, soldering, thermocompression, ultrasonic)*
- Superior optical resolution*
- Full process traceability and protocol function incl. photo and video capturing
- Ready-to-work design and easy-to-use operator interface
- Plug & Play configuration of process modules
- Unique cost-performance ratio
Functions - Modules - Enhancements
Our solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system. Retrofittable at any time, they enable additional bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the machine easier and help to make certain technology and process sequences even more efficient.
Enhances the existing Bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Ensures safe handling of components from GelPak®, VR trays, waffle packs or tape holders.
Used to flip components prior to face-down assembly.
Manual or motorized squeegee units for presentation of adhesives or flux, suitable for various sized die. Rotary and linear versions with adaptable layer thicknesses.
Motorized feed unit to move dispenser into working or parking position.
Various types of dispensing systems to apply flux, solder paste, adhesive or other material.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
Designed to bond components with a defined distance to the substrate.
Allows the exchange of the achromatic lens to work with different fields of view and optical resolutions.
Allows rotating the tool (and component) at the placement arm to correct angular errors.
Vision Alignment System with one camera and fixed beam splitter for an easy and direct alignment of the bonding partners.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Creates an inert or reactive (H2N2) atmosphere in an enclosure. Used to prevent or reduce oxidation during soldering or bonding.
Allows the in-situ observation of the working area during the bonding process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, gluing or thermosonic bonding
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
Enables coarse position alignment of the table to the tool with the help of a laser spot.
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet light in various wave length for adhesive processes without thermal influence.
Face-up Assembly of VCSEL and PD
Bonding of VSCEL and Photo Diode using a sophisticated reference tool. Process involves vision control of placement. Silver epoxy and curing are used in the application.
Face Down VCSEL Assembly on Transceiver Modules
Thermo-compression bonding process for VCSEL to transceiver substrate assembly. Precise placement is achieved by aligning the VCSEL eye to the substrate aperture.
FINEPLACER® lambda - R&D Bonder
The modularly designed FINEPLACER® lambda bonder provides a wide spectrum of process capabilities and the highest flexibility in a single platform. Quality optics deliver sub-micron accuracy and repeatability. Multiple bonding technologies make for an ideal research facility system.
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are ...
Laser Bar Bonding
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.