Sub-Micron Table Top Die Bonder
The table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.
Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.
The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic die bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions.
We use the FINEPLACER® lambda 2 for development processes on MEMS, e.g. for precise dispensing and the placement of microstructures. The system fits in with the investment strategy at ISS, where flexible facilities with a wide range of materials enable research into new materials and, in particular, rapid prototyping. Going forward, this will enable us to develop new capabilities for our customers' ideas at an even faster rate.
Severin Schweiger, Fraunhofer IPMS, Integrated Silicon Systems
Key Facts*
- Sub-micron placement accuracy
- Superior optical resolution
- Excellent price performance ratio
- Manual or semi-automatic machine versions
- Individual configurations with process modules
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- Full process access & easy visual programming with touch screen interface
- Various bonding technologies in one recipe
- Process module compatibility across Finetech platforms
- In-situ process observation in HD
- Modular machine platform allows in-field retrofitting during entire service life
- Synchronized control of all process related parameters
- Overlay vision alignment system (VAS) with fixed beam splitter
- Sequence control with predefined parameters
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers' requirements and offer a wide range of configuration options. In addition to the system's basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
Enhances the existing bond force range and allows the use of software controlled process forces.
Provides various bonding force ranges and allows the mechanical adjustment of different process forces.
Allows extending the field of view in Y-direction.
Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding
Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.
Allows flipping of components prior to face-down assembly.
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.
Software extension for creating and using virtual forms in the camera image to support relative and face-up alignment processes.
Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.
For precisely setting a defined gap between component and substrate.
Allows using different achromatic lenses to adapt the field of view and optical resolution.
Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.
Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.
Precise visual alignment of chip and substrate.
Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.
Enhances a process gas module to handle two different gases for programmed selection in the process.
Allows the in-situ observation of the working area during the bonding process.
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
Use different tools or tool tips in process.
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.
Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.
Technical Paper
VCSEL Bonding
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...
