Finetech to host Micro Assembly Day

On May 17, 2018, Berlin-based machine supplier Finetech will host a new edition of the popular “Micro Assembly Day” series. This recurring one-day conference highlights current challenges and solutions in micro assembly and advanced packaging.

The event brings together customers and prospects from science and industry for an exchange of experience and is an excellent platform to share ideas and inspire new and exciting projects. In its previous edition, the Micro Assembly Day attracted more visitors than ever from all over Europe.

The Micro Assembly Day 2018 offers sessions on some of today’s hottest market trends. In addition, high-profile speakers will report on scientific advances in developing innovative assembly and packaging technologies. This year, the participants will also get an exclusive preview of new product developments for Finetech's die bonder division for R&D and production.

The day before, on May 16, all participants are invited to join a get-together dinner at the Berlin Humboldt Box roof top restaurant and kick off the Micro Assembly Day in a relaxed atmosphere.

Individual consultations on Friday
Following a good tradition, the day after the conference can be used for individual consultations with the Finetech specialists. Interested visitors can also participate in hands-on sessions for a first-hand experience of Finetech’s die bonder systems.

Preliminary agenda and registration.


С учётной записью Вы получаете:

  • моментальный доступ к брошюрам по всем продуктам
  • доступ к технической информации (после активации)
  • доступ к техническим статьям и докладам (после активации)

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