Customer Stories

All around the world, customers rely on Finetech’s expertise. Working in close partnership, we create solutions that make a difference.

Automated Production of Complex Transceiver Modules

For the development and production of a particularly resilient transceiver module, Ultra Communications sought out Finetech’s high precision bonding equipment and experience with complex opto-electronics assembly.

Ultrasonic Flip Chip Bonding for Bilkent University UNAM

How Finetech assisted the National Nanotechnology Research Center (UNAM) in Turkey during the COVID-19 pandemic to retrofit and successfully deploy their existing FINEPLACER® system for a demanding ultrasonic flip-chip bonding application.

New Possibilities in R&D of Innovative MEMS Sensors

Dr. Shih-Wei Lin from the Micro Device Laboratory at NTHU, Taiwan, relies on the sub-micron die bonder FINEPLACER® lambda 2 for the development of innovative micro sensors and actuators for IoT, mobile phones and smart X.

Serving the Electronic Coast®

How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions.

The Core of Highly Flexible Rework

Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications.

Brain Implant Gives New Hope to Epileptics

The British CANDO project develops brain implants for epileptics which could actively avoid life-threatening seizures. Measuring only few micrometers, the implants are assembled with a FINEPLACER® high-precision die bonder.

Bright Examples of True Precision

How an Asian display manufacturer successfully improved its yield up to 100% in production of small SMD LED carrier boards by employing a Finetech-developed multi-stage rework process.

Everything at a Glance

Finetech ensures information flows right on time: Aditech’s modern LCD Displays for transportation and industrial applications are manufactured on multiple automated FINEPLACER® die bonders.

Reliable Rework Returns

From the first to the 2000th board – Finetech designs reproducible processes for high-volume BGA rework.

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