anisotropic conductive adhesive bonding

各向异性胶的胶粘贴片

作者: Ralph Schachler

摘要: 无法想象一个柔性电路板与玻璃基板无法进行电性互联的世界会是怎样。柔性基板到玻璃基板(FOG)是大多数现代显示器的首选解决方案,常见于智能手机、笔记本电脑和平板显示器中,就好比使用玻璃基板的传感器一样多,如平板数字X射线探测器(FPXD)。随着持续不断的微型化趋势,越来越多的芯片与玻璃(COG)直接键合在一起。通常,这种工艺需要配合使用各向异性导电膜或胶,与普通胶水或锡焊料相比而言具有完全不同的功能原理,并且需要不同的工艺。这篇技术论文介绍了这项技术,向您描述典型的挑战和成熟的解决方案。


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