RFID Assembly

作者:Michael Wolff

摘要:射频芯片(Radio Frequency Identification)在工业和消费电子类产品中的使用越来越多。其典型应用领域包括门禁系统和产品追踪。射频芯片的尺寸从若干毫米至数微米,而基板轻薄、柔性好且容易产生热应力。射频芯片包括带有2-4个焊点的无源射频电路。两个焊点具有电学性能,另外的其他焊点确保机械稳定性。在研发和生产中,Finetech的贴片机非常适用于射频芯片在各种基板上的封装。本文描述了在柔性基片上使用双组份胶水进行多射频芯片封装的典型挑战,以及Finetech从小批量到大批量生产的工艺转移的方案。


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Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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