cross section after thermocompression bonding

热压键合

作者:Sascha Lohse, Ralph Schachler

摘要:热压键合是一种快速、简便、可靠地焊接倒装芯片的方法。顾名思义,这种键合方式需要借助压力和温度。这就意味着多种键合工艺,甚至用于激光巴条焊接的使用压力的共晶焊都属于这一类。在文献资料和业内专家当中“热压键合”一词并没不常见,因此很难找到一个确切的定义。在接下来的文章中,我们专注于用于金球凸点或者铟凸点的热压键合工艺。采用这种键合工艺的倒装芯片键合具有诸多优点,并且展现出了优异的连接性能。然而,它仍然是一种小众的技术——没有经过普遍验证,正如本文所展示的那样。本文对该工艺进行了概述,并介绍了典型的工艺参数。本文还讨论了使用这种技术所带来的挑战,并且展示了FINEPLACER®芯片贴片机是如何应对这些挑战的。


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Finetech USA/East Coast
+1 603 627 8989
Send an email

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